NPI Project Engineering Section Manager (Assembly) - Semiconductor

The NPI Project Engineering Section Manager (Assembly – Semiconductor) is responsible for leading New Product Introduction (NPI) projects from customer design release through qualification and successful transition into high-volume mass production.

This role serves as the key technical interface between global semiconductor customers and internal Engineering, Quality, Manufacturing, and Operations teams, ensuring new products are industrialised effectively and delivered in accordance with customer requirements, project timelines, and quality standards.

The position will lead cross-functional NPI activities for advanced IC packaging and assembly solutions, with a strong focus on process readiness, product qualification, yield optimisation, technical problem-solving, and manufacturing ramp-up to ensure a smooth and reliable transition into mass production.

Key Responsibilities:

• Lead end-to-end New Product Introduction (NPI) activities, including engineering builds, product and package qualification, process validation, and production ramp-up in accordance with customer specifications and project timelines.
• Coordinate cross-functional teams, including Process Engineering, Manufacturing, Quality, Test Engineering, and Supply Chain, to ensure alignment with customer technical requirements and successful NPI execution.
• Monitor and analyse production yield, Statistical Process Control (SPC) data, process capability, and reliability performance to identify improvement opportunities and drive continuous yield optimisation.
• Lead structured root cause investigations for manufacturing, quality, and reliability issues using methodologies such as 8D, FMEA, and Control Plan reviews, ensuring effective corrective and preventive actions are implemented.
• Serve as the primary technical interface with global semiconductor customers, managing technical reviews, project status updates, engineering requirements, issue resolution, and Product Change Notification (PCN) activities.
• Manage engineering risks, technical issues, and project dependencies to ensure successful product qualification and smooth transition into high-volume mass production.
• Ensure NPI and manufacturing activities comply with applicable semiconductor, automotive, and customer quality standards, including IATF 16949, JEDEC, IPC, APQP, and PPAP requirements.
• Drive continuous improvement initiatives across NPI processes, product quality, yield, manufacturing readiness, and overall engineering execution.

Qualifications & Experience:

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Engineering, Mechanical Engineering, Industrial Engineering, Semiconductor Engineering, Physics, or a related technical discipline.
• Minimum 2–8+ years of experience in Semiconductor Assembly, IC Packaging, Test Engineering, NPI Engineering, or NPI Project Management, depending on position level.
• Strong hands-on knowledge of semiconductor assembly and packaging processes, including Wafer Saw, Die Attach, Wire Bond, Flip Chip, Molding, Trim & Form, Singulation, and Final Test.
• Good understanding of advanced semiconductor package technologies, including QFN, BGA, LGA, FCBGA, and System-in-Package (SiP).
• Strong knowledge and practical application of quality and root cause analysis tools, including 8D, 5-Why, Fishbone, FMEA, Control Plan, MSA, and SPC.
• Experience analysing engineering, yield, and manufacturing data using tools such as JMP, Minitab, Power BI, Microsoft Excel, or SQL.
• Good understanding of semiconductor reliability testing and applicable JEDEC standards, including HAST, HTOL, Temperature Cycling, and Moisture Sensitivity Level (MSL) testing.
• Familiarity with automotive quality requirements, including IATF 16949, APQP, and PPAP, is preferred.
• Strong project management capabilities with experience managing engineering builds, product qualification, manufacturing ramp-up, timelines, risks, and cross-functional deliverables.
• Strong analytical and technical problem-solving skills, with the ability to investigate complex manufacturing and reliability issues and drive effective corrective actions.
• Excellent customer-facing communication and stakeholder management skills, with the ability to work effectively with global semiconductor customers and cross-functional engineering teams.
• Fluent in both Thai and English, written and spoken, with the ability to communicate confidently with international customers and stakeholders.
• PMP, Six Sigma Green Belt, or Six Sigma Black Belt certification is an advantage.

Key Performance Indicators (KPIs):

• On-time delivery of NPI launches, engineering builds, qualification milestones, and production ramp-up schedules.
• Achievement of ramp-up yield targets and continuous reduction of manufacturing defects.
• Improvement of First-Time Pass Rate (FTPR) during package qualification and engineering builds.
• Reduction in customer quality complaints and improvement in turnaround time for 8D investigations and corrective action reports.