Optical 3D Packaging Technologist

MediaTek is seeking an experienced technologist to join our global advanced packaging team. You will be a key contributor in the development of optical‑interconnect packaging and 2.5D/3D/3.5D packaging solutions (CoWoS, SoIC, COUPE, CPO, HBM, FCBGA) that support our AI, Datacenter/HPC product families. The role bridges internal cross‑functional groups, external customers, and technology providers to deliver optical and advanced packaging solution and roadmap from prove of concept (PoC) to high volume production (HVM). Roles and Responsibilities:

• Develop and validate optical interconnect including Co-Package-Optics (CPO), Fiber Attachment Unit (FAU), Optical Engine (OE), etc. package/assembly solutions for 2.5D/3D/3.5D package architectures.
• Collaborate with package/chip design, thermal modeling, substrate engineering, PI/SI, and test engineering teams to deliver optical interconnect technology.
• Conduct DFM (Design‑for‑Manufacturability) analysis, generate design rule sets for 3DIC/CPO packages and documentations.
• Collaborate with internal cross-functional partners, including, Technology, Design, Test, Quality, GSM and Manufacturing Operation to meet product requirements (RFI, RFQ) and execute MP plans.
• Manage technology development, yield improvement, and production issue troubleshooting together with technology suppliers: Foundries, OSATs and substrate vendors.
• Develop/establish fundamental optical characterization methodology for key components and package/assembly process
• In charge of Package Qualification, New Product Introduction (NPI) and HVM.

Main Requirements and Qualifications

• MS/PhD degree in Mechanical Engineering, Optical Engineering, Material Science and/or related field.
• 5+ years’ experience in relevant fields – Optical device development, optical alignment process development, and mass production management.
• Participate in the process of bringing up a new technology from the PoC stage to high volume manufacturing.
• Proven ability to hands-on debug with strong problem-solving ability.
• Excellent communication/presentation skills in English.
• Manage projects Independently with on time delivery.
• About 10-15% international travel required.
• Location can be in San Jose (US), HsinChu (TW).

For San Jose position, Salary range: $188,000- $356,000

Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Sick Leave, Vacation time, Parental leave, 401K and more.

MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.