Package Design Methodology Engineer

For our client, we are seeking a Package Design Methodology Engineer to join the team of a leader in the Telecommunications & Hardware space.

This role will help shape the tools, workflows, and methodologies that support advanced package design engineering across silicon and substrate development. You will work closely with engineering teams to improve how designs are created, analyzed, and validated throughout the production process. The position combines software development, electrical engineering fundamentals, and practical workflow improvement to help engineers work more efficiently and deliver higher-quality outcomes.

Location: Remote - US based candidates only, no visa sponsorship available

Compensation: $136,000 – $264,500 annually

Responsibilities

• Collaborate with engineering teams to create VLSI tools for silicon and substrate design
• Develop applications that are maintainable and user-friendly for project engineers
• Create methodologies for constructing, analyzing, and validating package designs throughout production stages
• Improve daily workflows for package design engineers

Qualifications

• BS in Computer Science, Electrical Engineering, or a related field, or equivalent experience
• 5+ years of experience in flow and methodology development for large-scale engineering teams
• Proficiency in Python and/or C++, with a strong grasp of data structures, algorithms, and code quality practices
• Experience with AI/ML applications in engineering workflows, including LLMs and ML-assisted tools
• Strong understanding of electrical engineering principles relevant to VLSI package design, including signal integrity and power delivery

Benefits

• Comprehensive benefits package for employees and their families
• Equity opportunities as part of compensation

Our client is an equal opportunity employer. We encourage you to apply even if you don’t meet every qualification—your background could be exactly what this team needs.