Package Development/NPI Engineer

About the Role

MediaTek is seeking a proactive, skilled Package Development/NPI Engineer who will drive advanced package technologies from initial development through to mass production (MP). The position encompasses close collaboration with internal cross-functional teams, external partners, Foundries, OSATs, substrate vendors and customers- to deliver cutting-edge packaging solutions for automotive, datacenter/HPC, and computing applications. The candidate will help bridge the development and manufacturing phases, ensuring robust New Product Introduction (NPI), successful ramp-up, and the transfer into MP. This role requires deep technical acumen and strong cross-functional teamwork, as well as ownership and drive for effective execution.

The Package Development/NPI Engineer will be responsible for driving advanced package technologies from initial development through to mass production (MP).

Responsibilities

• Lead the transition of advanced packaging products from Development to MP, managing the NPI process, qualification, and production ramp-up.
• Collaborate with internal cross-functional partners, including Technology, Design, Test, Quality, GSM and Manufacturing Operation, to define product requirements and execute MP readiness plans.
• Manage technology transfer, yield improvement, and production issue troubleshooting together with external partners, OSATs and substrate vendors.
• Support and execute prototype builds, product qualification, reliability testing, and failure analysis; define root cause and implement corrective actions as needed.
• Lead risk assessment and technical reviews during product ramps; develop robust contingency and improvement plans.
• Ensure all deliverables and milestones for NPI to MP are met with high quality and on schedule.

Qualifications

• Solid hands-on experience (8+ years) in package development, NPI, and packaging assembly engineering, driving products from early development to HVM/MP in semiconductor industry.
• Technical expertise in advanced packaging technologies such as EMIB, 2.5D/3D/3.5D, FCBGA, HBM integration, and related interconnect technologies.
• Comprehensive understanding in qualification, reliability, and failure analysis methodologies for advanced packaging.
• Experience with yield improvement and production support in a manufacturing environment.
• Proven project management abilities in cross-functional and cross-regional environments.
• Effective communicator, able to interface with internal teams, suppliers and customers.
• About 25-40% international travel required.
• Location can be in San Jose, or Chandler AZ.

Pay range and compensation package

Salary range: $180,000- $301,000. Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Sick Leave, Vacation time, Parental leave, 401K and more.

Equal Opportunity Statement

MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.