Package Equipment Engineering Manager / Lead – Semiconductor Manufacturing

Package Equipment Engineering Manager / Lead Semiconductor Manufacturing

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Employment Type: Full-Time

Experience: 12- 18 Years

Industry: Semiconductor / ATMP / OSAT / IC Packaging

Role Overview

We are looking for a Package Equipment Engineering Manager/Lead to manage equipment engineering for high-volume semiconductor assembly and packaging operations. The role will own equipment installation, qualification, performance, availability, maintenance strategy and continuous improvement across assigned packaging process areas.

The position requires hands-on experience with semiconductor assembly equipment, strong equipment troubleshooting capability and demonstrated leadership of engineers, technicians and equipment-improvement programs.

Key Responsibilities

• Lead the package equipment-engineering team supporting 24 7 semiconductor manufacturing operations.
• Own equipment performance across die preparation, die attach, wire bonding, molding, marking and package singulation.
• Manage equipment installation, setup, acceptance testing, qualification and production release.
• Develop equipment specifications, user requirements and technical acceptance criteria.
• Coordinate equipment hook-up, safety checks, calibration and process qualification activities.
• Establish preventive, predictive and condition-based maintenance strategies.
• Improve equipment availability, utilization, OEE, mean time between failures and mean time to repair.
• Lead technical troubleshooting for chronic equipment failures, process excursions and production interruptions.
• Use equipment data, alarms, logs and failure history to identify performance-improvement opportunities.
• Develop maintenance procedures, spare-parts strategies, equipment checklists and escalation mechanisms.
• Manage equipment vendors during installation, warranty support, upgrades and corrective actions.
• Partner with process engineering to improve equipment capability, repeatability and process control.
• Support new-product introduction, capacity expansion and production ramp-up requirements.
• Drive equipment automation, sensor integration, data collection and predictive-maintenance initiatives.
• Lead equipment modifications, retrofits, cost reduction and productivity-improvement projects.
• Ensure compliance with EHS, equipment-safety, cleanroom and quality requirements.
• Build technical capability through recruitment, training, mentoring and competency development.
• Prepare performance dashboards and communicate equipment risks, recovery plans and capital requirements.

Required Qualifications

• Bachelor s or Master s degree in Mechanical, Electrical, Electronics, Mechatronics, Instrumentation, Automation Engineering or a related discipline.
• 12 18 years of equipment-engineering experience in semiconductor assembly, packaging, ATMP, OSAT or IDM backend manufacturing.
• At least 4 6 years of experience leading equipment engineers, technicians or major equipment programs.
• Strong hands-on experience with multiple semiconductor packaging equipment platforms.
• Demonstrated experience in equipment installation, qualification and high-volume manufacturing support.
• Proven record of improving OEE, equipment availability, MTBF, MTTR and manufacturing capacity.
• Experience managing equipment vendors, service contracts, spare parts and technical escalations.
• Ability to support production and equipment escalations in a 24 7 manufacturing environment.

Technical Skills Semiconductor Packaging Equipment

• Wafer mounters and backgrinders
• Wafer saw and dicing systems
• Die sorters and pick-and-place systems
• Die bonders and die-attach equipment
• Wire bonders
• Flip-chip bonders
• Underfill and dispensing systems
• Transfer or compression molding equipment
• Trim-and-form systems
• Laser marking equipment
• Package saw and singulation systems
• Inspection and material-handling equipment

Equipment Engineering

• Equipment installation and commissioning
• Site Acceptance Test and Factory Acceptance Test
• Equipment qualification and production release
• Equipment capability analysis
• Preventive and predictive maintenance
• Condition monitoring
• Calibration and metrology
• Equipment modification and retrofit
• Troubleshooting and fault isolation
• Spare-parts and lifecycle management

Automation and Controls

• PLC and industrial controls
• Servo and motion-control systems
• Sensors, pneumatics and robotics
• Machine vision
• Equipment software and alarm systems
• SECS/GEM
• Equipment data collection
• Manufacturing Execution Systems integration
• Automated material handling
• Predictive-maintenance analytics

Reliability and Improvement Tools

• Overall Equipment Effectiveness
• Mean Time Between Failures
• Mean Time to Repair
• Failure Mode and Effects Analysis
• Root-cause analysis
• 8D problem-solving
• Fault Tree Analysis
• Pareto analysis
• Total Productive Maintenance
• Statistical Process Control

Leadership Responsibilities

• Build and lead a capable package equipment-engineering organization.
• Establish equipment ownership across process modules and production lines.
• Define escalation procedures and technical response requirements.
• Develop engineers and technicians through structured training and mentoring.
• Manage staffing, shift coverage and on-call support for continuous operations.
• Coordinate equipment resources during installation, capacity ramp and critical failures.
• Establish vendor-performance and equipment-maintenance review mechanisms.

Key Performance Indicators

The Position Will Be Responsible For Improving

• Equipment availability
• Overall Equipment Effectiveness
• Mean Time Between Failures
• Mean Time to Repair
• Equipment utilization
• Unplanned downtime
• Preventive-maintenance compliance
• Equipment-related yield loss
• Units per hour
• Maintenance cost
• Spare-parts availability
• Capacity and production readiness

#LI-SD1