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Package technology Reliability senior engineer/Technical manager I

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Onsite

Package technology Reliability senior engineer/Technical manager I

MediaTek

Package technology Reliability senior engineer/Technical manager I

1 month ago

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Important information


Contract type:

Permanent

Location:

Hsinchu, North District, Hsinchu City, Taiwan

Work mode:

Onsite

Published on:

16 September 2026

What they need


  • New Product risk assessment and assembly chip level & board level reliability qualification plan 2. Qualification failure electrical & physical analysis 3. New product reliability concern engagement with customer 4. New assembly supplier audit & qualification 5. Assembly supplier quality & reliability management (Quality incident handling, PCN, regular audit, score card, etc.) 6. New product/technology introduction quality & reliability management 7. Assembly supplier quality improvement project

Main Requirements and Qualifications

    1. MS degree (or above) in Science or Engineering.
  • 2.Familiar with Assembly or substrate processes. (FCCSP/WLCSP/Wire bond/InFO/CoWoS)
    1. Familiar with problem solving and 8D CAR methodology
    1. VQA/IQA or MQR related experience
    1. Package IC & Board level reliability qualification experience

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