MediaTek
Package technology Reliability senior engineer/Technical manager II
3 months ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
7 August 2026
What they need
- New Product risk assessment and assembly chip level & board level reliability qualification plan 2. Qualification failure electrical & physical analysis 3. New product reliability concern engagement with customer 4. New assembly supplier audit & qualification 5. Assembly supplier quality & reliability management 6. New product/technology introduction quality & reliability management 7. Assembly supplier quality improvement project
Main Requirements and Qualifications
- MS degree (or above) in Science or Engineering.
- Familiar with 3D advanced package (ex: SOIC) or Silicon Photonic (CPO) assembly technology
- Familiar with problem solving and 8D CAR methodology
- MQR related experience
- Package IC & Board level reliability qualification experience
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