Packaging Intern

Experience Level: Support

Job Type: Intern

Location:
Greensboro, NC, US, 27409

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Requisition ID: 10658

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Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available.

Qorvo’s Internship Program offers:
Challenging, skill-building assignments

Mentoring and coaching from industry experts

Launch & Learns and other learning opportunities

Collaborative team-based work environment

Networking and social events

Final presentation to business leaders

Qorvo’s Packaging Engineering Internships are offered in our Global Operations business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities may include:
Learn about Technology Development projects methodologies - to help and improve the process

Learn about Design Rules and Assembly Process - Foster and mentoring

Review Assembly and Marking diagram - look for opportunities to improve

Material and BOM review and support of project deployment

Onsite hands-on learning in semiconductor assembly processes

Other minor activities related to documentation and continuous improvement (i.e. A3 documentation as part of Lean)

Qualifications:
BS in Materials Science or Mechanical Engineering

Mechanical/Material Engineering skills

Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred

Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred

Experience using simulation software (i.e. ANSYS, COMSOL, SolidWork Simulation) is preferred

Familiarity with automating simulation tasks using scripting or macros is preferred

Communication and presentation skills

Ability to manage and drive problem resolution

Demonstrate strong analytical thinking skills

3.0 GPA or higher

This position is not eligible for visa sponsorship by the Company.

Competitive hourly pay commensurate with experience: $31/hr - $42/hr (subject to change dependent on physical location)

Posted salary ranges are made in good faith. Qorvo reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as external competitiveness and internal comparability.

Base compensation is one element of Total Rewards offered at Qorvo. More information on the Total Rewards package can be shared upon request.

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.

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Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.