Packaging Manager

Senior Packaging Manager – Production Engineering

Location: Zürich, Switzerland

A leading global semiconductor technology company is seeking an experienced Senior Packaging Manager – Production Engineering to lead and develop a high-performing engineering team responsible for semiconductor production, assembly, test and packaging. This is a key leadership position combining technical expertise, people management and strategic manufacturing responsibility , with significant influence over production readiness, industrialisation, yield, cost and time-to-market.

The Role:

As Senior Manager, you will lead a team of Production Engineers and Package Engineers, providing both technical direction and strong people leadership. You will play a central role in ensuring stable, high-yield and cost-effective semiconductor manufacturing across a global supply chain. You will be responsible for driving new product industrialisation through to high-volume production, while working closely with internal teams and external manufacturing partners.

Key Responsibilities:

• Lead, coach and develop a team of Production and Package Engineers.
• Provide clear technical direction and support the professional development of the engineering team.
• Own production readiness, industrialisation and high-volume manufacturing ramp-up for new products across assembly and test.
• Drive yield improvement, cost reduction and production capability enhancements across manufacturing operations.
• Lead the resolution of production issues, including yield excursions, equipment-related challenges and reliability risks.
• Oversee package development activities, ensuring reliability, performance, quality and manufacturability targets are achieved.
• Manage and develop relationships with external manufacturing partners, including fabs, OSATs and test houses.
• Ensure robust documentation, change control and alignment of production and package specifications across the organisation and supply chain.
• Work cross-functionally with Engineering, Operations, Quality, Product Development and external suppliers.
• Support continuous improvement and manufacturing optimisation initiatives.

Your Background:

• A University degree in Electrical Engineering, Microelectronics, Materials Science, Mechanical Engineering or a related technical discipline.
• Several years of experience within semiconductor production, assembly, test and/or packaging engineering .
• Proven experience leading, coaching and developing technical engineering teams.
• Strong understanding of IC manufacturing flows, yield management and production ramp-up .
• Experience working with external manufacturing partners, including fabs, OSATs and test houses .
• A structured, analytical and data-driven approach to problem solving.
• Excellent communication and stakeholder management skills.
• Experience working within a fast-paced, high-volume semiconductor manufacturing environment.
• Fluent English is essential; German language skills would be advantageous.