PCB layout Engineer

Job Title - PCB layout Engineer / Package Substrate Layout Engineer

Job Location

• Maynard-MA – (Fully Onsite)

Project Duration - 6 months + Chances of its further extension

Experience Range

• 10+ Years

Job Description

Responsibilities

• Develop PCB and package substrate layouts for advanced optical communication products.
• Ensure compliance with IPC standards, design guidelines, and manufacturing capabilities.
• Collaborate with electrical, mechanical, SI/PI, thermal, and manufacturing teams.
• Work with fabricators and substrate vendors to resolve DFM issues.

Minimum Requirements

• Bachelor’s degree or equivalent certification with 10+ years of relevant experience.
• Expert proficiency in Cadence Allegro PCB design tools.
• Strong experience in high-speed, high-density PCB and substrate layouts, including HDI, microvias, sequential lamination, and fine-pitch BGA.
• Experience with multilayer organic substrates and advanced component packages.
• Knowledge of transmission-line geometries, including microstrip, stripline, and CPW.
• Experience designing compact, high-current multiphase DC-DC power converters.
• Strong understanding of PCB fabrication, assembly, DFM, and manufacturing tolerances.

Preferred Skills

• Experience with mSAP PCB layout and optical pluggable products (CFP2, QSFP-DD, OSFP).
• Proficiency in Cadence SiP and package substrate layout.
• Experience with wire-bond components.
• Knowledge of IPC Class 2/3, JEDEC, and other relevant industry standards.