PCB layout Engineer, Transmission

该职位来源于猎聘 Job Requirements Education:

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics, Telecommunications, or a related technical field.
• Coursework or research focus on high-frequency circuit design, electromagnetic fields, or signal integrity analysis is highly preferred.
• Relevant certifications in advanced PCB design tools (e.g., Cadence Allegro Expert, HyperLynx SI/PI) or IPC CID/CID+ certification are considered a strong plus.
• Continuous professional development in emerging optical interconnect standards (OIF CEI, IEEE 802.3) is expected. Experience:
• Minimum of 3 years of dedicated PCB layout experience, with at least 1 years specifically focused on high-speed optical modules or coherent DSP-based systems.
• Proven track record of designing multi-layer HDI boards featuring fine-pitch BGA breakout for high-performance DSPs and drivers.
• Extensive hands-on experience with high-speed serial interfaces including 112G PAM4, and OIF-CEI standards, ensuring compliance with strict loss budgets and crosstalk requirements.
• Demonstrated success in managing the full design cycle from concept and schematic capture review to prototype bring-up, debugging, and volume production release.
• Experience working in cross-functional teams within the optical networking industry, familiar with module packaging constraints (thermal, mechanical, fiber management).
• Prior involvement in designs utilizing advanced materials (low-loss laminates) and advanced manufacturing technique (e.g., mSAP) to minimize insertion loss.
• Familiarity with regulatory compliance testing (FCC, CE) and the ability to implement layout changes based on EMI/EMC pre-compliance results. Special Skills:
• EDA Tool Mastery: Expert-level proficiency in Cadence Allegro PCB Editor or Altium Designer or Mentor and Constraint Manager.
• Deep understanding of differential pair routing, length matching, via stubbing mitigation, back-drilling requirements, and reference plane continuity.
• Ability to design thermal dissipation in high-power density modules, including thermal via arrays, copper balancing, and collaboration with mechanical engineers on enclosure fit.
• Strong knowledge of PCB fabrication capabilities (HDI, laser drilling, sequential lamination) and SMT assembly processes to optimize yield and testability.
• Excellent analytical skills to troubleshoot signal integrity issues, ground bounce, and power noise during lab characterization and validation phases.
• Knowledge of Python or AI-Agent assisted programming for structured data analysis, test automation is preferred.
• Language: Professional proficiency in English (written and spoken) for global team collaboration and technical documentation. Competencies: Individual Contributors Adaptability, Innovation, Problem Solving, Continuous Improvement, Reliable and Dependable, Results Oriented, Work Standards/Quality/Details

Job Element Wt % Specific Duty 1) Work on New Product Initiatives 90% A) PCB layout design for optical pluggable B) Work with SI/PI, HW engineer to optimize layout and EMC 2) Team Build and Others

10% A) Contribute to improving work efficiency

B) Team cooperation with other functional teams