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Physical Design Engineer

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Onsite

Physical Design Engineer

国药洁诺医疗服务有限公司

Physical Design Engineer

Skills

NodeR

3 months ago

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Important information


Contract type:

Permanent

Location:

Shanghai, China

Work mode:

Onsite

Published on:

11 August 2026

What they need


该职位来源于猎聘 Job Description Looking for a talented and highly self-motivated candidate that has strong background and hands-on experience in the physical design for advanced technology nodes. The candidate will work on the physical implementation of our state-of-art SoC products. Driving all aspects from RTL to GDS including timing and physical trade-offs, die size reduction and delivery of final product on schedule while meeting design goals. Responsibilities:

  • Perform physical implementation of the ASIC design from netlist to GDS, including floorplanning, power grid and clock network implementation, place and route, timing closure and physical verification.
  • Work with multiple teams on the SoC architecture study and timing/power/area design target.
  • Working with different IP owners to ensure seamless IP integration at full chip level.
  • Writing scripts for design automation flow and productivity enhancement. Job Requirement:
  • Experience in ASIC Physical Design from netlist to GDSII.
  • Experience in using EDA tools such as Synopsys ICC or Cadence SOC Encounter
  • Hands on experience in Floorplanning, CTS, STA
  • Experience in Power grid, clock tree, and low-power flow implementation methods
  • Hands on experience with STA using Primetime, power analysis.
  • Hands on experience with IR drop analysis, formal verification and physical verification.
  • Timing closure, ECO process using PrimeTime
  • Programming and scripting skills (Tcl, perl ,shell)
  • DFT/DFM knowledge is a plus
  • Self-motivated and able to work effectively in a start-up environment
  • Ability to execute to stringent schedule & die size requirements and effective communication skills 工作职责: - 负责芯片从网表到GDS的后端物理实现,包括布局规划,时钟树生成(CTS), 布局布线,时序优化和收敛,以及GDS的物理验证 - 和多个设计团队合作制定芯片结构,参与制定芯片性能/面积/功耗等方面的设计目标, - 与不同功能模块的设计团队合作保证功能模块的顺利集成。 - 优化后端设计自动化的流程和提高团队设计开发效率 任职要求 - 后端工作经验,微电子或者相关学科硕士以上学历 - 良好的沟通能力和团队精神,能够在精干的团队环境里高效率的发挥自己的能力。 - 熟练使用主流P&R流程工具(Synopsys、Cadence的相关P&R工具) - 具有从netlist到GDS整个流程的实际经验,包括布局规划,power gird,时钟树生成(CTS),布局布线设计,时序收敛,IR-drop,lvs/drc。 - 具备扎实的时序分析知识与signoff的技能。 - 具备DFT/DFM相关经验的优先。 - 熟练的脚本编写技能(Tcl,perl, shell)

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