Physical Failure Analysis (PFA) Technician

Job Responsibilities

• Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools.

• Perform sample preparation, cross-sectioning, decapsulation, polishing, microscopy inspection, and other laboratory techniques as required for failure analysis investigations.

• Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM, and other failure analysis tools.

• Write and document failure analysis findings, and FA reports in a timely manner.

• Ensure compliance with laboratory safety requirements, equipment operating procedures, quality management systems, and 6S housekeeping rules.

• Participate in continuous improvement initiatives to enhance laboratory efficiency, analytical capability, and turnaround time.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Qualifications and Work Experience

• Minimum NITEC, Higher NITEC or Diploma in Engineering or equivalent.

• Minimum 1-2 years of working experience in semiconductor failure analysis.

• Hands-on experience with SEM/EDX, FIB, X-ray,C-SAM, and sample prep tools.

• Fundamental knowledge of semiconductor wafer fabrication, and advanced packaging processes.

• Self-motivated, proactive, and able to communicate effectively with stakeholders at all levels.

• Ability to work independently as well as collaboratively with other teams.

• Proficient in Microsoft Office applications and technical report preparation.

• Commitment to safety, quality, and continuous improvement.