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PIM (Si Gel Filled) Power Module Development Engineer

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Onsite

PIM (Si Gel Filled) Power Module Development Engineer

onsemi

PIM (Si Gel Filled) Power Module Development Engineer

Skills

Product StrategyRisk Management

1 month ago

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Important information


Contract type:

Permanent

Location:

Shenzhen, Guangdong Province, China

Work mode:

Onsite

Published on:

12 September 2026

What they need


  • New package technology and platform module development (Si-gel filled module).
  • Technical leadership on new power module technology and enabling technology for automotive/industrial application.
  • Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
  • Package/design review for new package development, on-tme release with the first pass success (qualification).
  • Present technical finding, design review and recommendation to stakeholders and management.
  • Lead package related failure analysis, reliability testing and debug package issues.
  • Participate in customer meeting, provide technical clarification and support failure investigation.

Responsibilities

  • Define power module package strategy aligned with product roadmap.
  • Own end-to-end package development from concept to qualification upon company's package development procedures.
  • Ensure package reliability, performance, and manufacturability.
  • Establish and optimize packaging processes and specifications.
  • Collaborate with cross-functional teams (design, wafer fab, test, product engineering).
  • Evaluate and introduce new packaging technologies and materials.
  • Manage risk, cost, and schedule for packaging programs.
  • Support customer engagement for technical discussions and issue resolution.
  • Serve as subject matter expert (SME) for packaging within the organization.

Qualifications

  • Minium Bachelor's degree of material science or mechanical engineering.
  • More than 8 years of power module package development experience including transfer to the production.
  • Preferred Si gel filled module package development experience with SiC device.
  • Good statistical analysis skills with Minitab or JMP.
  • Preferred the knowledge to use Auto CAD software
  • Good communication skills with English.

About Us onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

About The Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

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