Power Module Packaging Development Manager

Responsibilities

1. Lead the structural packaging design and development of Power Modules.
2. Responsible for process design and process development.
3. Develop and design power module substrates and metal lead frames.
4. Introduce and qualify new materials and manufacturing processes for power modules.
5. Support new product pilot runs, process integration, and process improvement activities.
6. Establish, manage, and maintain development documentation and Bills of Materials (BOMs).
7. Manage and maintain development documents and design specifications.
8. Perform tolerance analysis and dimensional chain analysis, and define product appearance specifications.
9. Evaluate manufacturing feasibility for new products and drive continuous process improvements.

Requirements

1. Minimum 5 years of hands-on experience in power module design and development.
2. Familiar with semiconductor packaging processes, metal lead frame design, and related manufacturing processes.
3. Strong knowledge of semiconductor packaging design and assembly processes.
4. Experience in new product introduction (NPI) and new material qualification.
5. Familiar with APQP (Advanced Product Quality Planning) and PPAP (Production Part Approval Process) methodologies.
6. Experience in preparing DFMEA (Design Failure Mode and Effects Analysis) is highly preferred.