Tylsemi
Principal CAD Engineer
Skills
1 month ago
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Important information
Contract type:
Permanent
Location:
Bengaluru, Karnataka, India
Work mode:
Onsite
Published on:
20 September 2026
What they need
{"company":"
About TYLsemi, Inc.
The Opportunity
The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package
Thats what we solve. TYLsemi builds the chiplet infrastructure IP - the IO, power delivery, and interconnect building blocks - that makes AI/HPC systems actually work at scale.
This isnt a nice-to-have. Its the critical path.
Why Now The Market Window
The semiconductor industry is going through its biggest architectural shift in 40 years:
- Moores Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.
- Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI - theyre all designing their own ASICs. The $50B custom silicon market is growing 30% annually.
- IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.
- Translation: Were entering the market at exactly the moment when every major AI/HPC player needs what were building, and their alternatives are disappearing.
Culture & Team: How We Work No Politics, No Bureaucracy
There are no layers, no approval chains, no corporate theater.
- If you have an idea, we test it. If it works, we ship it.
- No endless meetings, no PowerPoint presentations to convince middle management.
Remote-Friendly, Global Team
- US team: Bay Area preferred, but we hire the best people regardless of location
- India team: Building a world-class design center in Bangalore
Move Fast, Ship Real Products
Were not a research project. We have paying customers, committed capital, and aggressive timelines.
This is a company, not a lifestyle business. Were building to win.
What We Value
- Ownership mindset. Youre not here to execute someone elses roadmap. Youre here to define it.
- Bias for action. We move fast. Analysis paralysis doesnt fly here.
- Deep technical expertise. This is hard engineering. We need people whove shipped real silicon and debugged real hardware.
- Low ego, high standards. We dont care about titles or politics. We care about results.
The Ask
If youre reading this, youre probably comfortable. You have a good job at a stable company with all the benefits.
Were asking you to walk away from that and bet on us.
Heres why you should:
- The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what were building.
- The team has done this before. Weve built and exited semiconductor companies at scale. This isnt our first rodeo.
- The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.
- The work is consequential. Youre not optimizing someones ad click-through rate. Youre building the silicon infrastructure that powers AI.
This is the bet. Join us and build something that matters.
Or stay comfortable. No judgment.
But if youre the kind of person who wants to take the shot, wed love to talk.
READY TO JOIN
","role":"
Role Overview
We are seeking an experienced Principal CAD Engineer to lead the development, deployment, and support of advanced VLSI CAD methodologies and automation solutions. The role focuses on improving design productivity, quality, and scalability across RTL-to-GDS implementation flows. The ideal candidate will work closely with Physical Design, Frontend, DFT, STA, and EDA vendors to drive robust CAD infrastructure and enable successful tape-outs for complex SOCs.
What You ll Do
Architect, develop, and maintain scalable CAD flows for synthesis, physical design, STA, low-power verification, and signoff.
Drive automation and methodology improvements to enhance design efficiency, runtime, and QoR.
Collaborate with design, verification, DFT, and implementation teams to understand flow requirements and deployment challenges.
Debug complex flow, tool, and infrastructure-related issues across project execution.
Integrate and qualify new EDA tool releases and advanced node methodologies.
Develop automation scripts, regression environments, dashboards, and flow monitoring infrastructure.
Work with foundries and EDA vendors on technology enablement and issue resolution.
Mentor engineers and establish CAD best practices across teams.
What We re Looking For
Bachelor s or Master s degree in Electronics, Computer Engineering, VLSI, or related field.
12+ years of experience in CAD engineering, physical design methodology, or EDA flow development.
Strong expertise in ASIC/SOC implementation flows including synthesis, P&R, STA, physical verification, and low-power methodologies.
Hands-on experience with industry-standard EDA tools such as Cadence, Synopsys, and Siemens EDA tool suites.
Strong programming and scripting skills in Tcl, Python, Perl, and Shell scripting.
Experience with distributed computing environments, regression frameworks, and infrastructure management.
Strong debugging, analytical, communication, and stakeholder management skills.
Good to Have
Experience with cloud-enabled EDA infrastructure and workload management systems.
Exposure to AI/ML-driven CAD optimization methodologies.
Knowledge of advanced technology nodes (5nm/3nm) and multi-die design flows.
Success in This Role Looks Like
Delivery of stable, scalable, and high-quality CAD flows adopted across multiple projects.
Significant improvements in design productivity, QoR, and runtime efficiency.
Fast resolution of tool and flow issues minimizing project execution risk.
Strong technical leadership, mentoring, and positive influence on engineering methodology.
"},"
Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.
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