Infineon Technologies (Malaysia) Sdn Bhd
Principal Engineer
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Malacca, Malaysia
Work mode:
Onsite
Published on:
13 August 2026
What they need
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?
Your role
Key responsibilities in your new role
In this role, you willlead the development, optimization, and qualification of manufacturing processes, ensuring projects achieve quality, cost competitiveness, manufacturability, and timeline objectives while supporting new product introductions and emerging technology requirements. You will provide technical leadership in process innovation, complex problem-solving, supplier collaboration, knowledge transfer, and cross-functional project execution, serving as a subject matter expert to drive process excellence and technology advancement across the organization.
- Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturability
- Responsible or supportfortechnical handshake and knowledge transferto Operations
- Generate and update relevant documents, (e.g. Process Specification ,PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR)
- Support prototype and development samples build
- Provide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap) for development projects
- Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects
- Be thetechnical lead for task force andcomplex problem-solving team using Statistical and analytical tools, (e.g. SPC, APC, DOE, 8D, FMEA, DFMEA, etc.)
- Identify and develop new Process technology andimprove Process capabilityto meet new requirements from Business divisions
- Support the definition of Process technology, material, machine and tooling
- Provide technical guidance/buddy to other engineers and project team
- Initiating, generating and drive IP ideas based on reading and research
- Keep abreast with emerging technologyto lead the definition and direction of Process technology, material, machine and tooling
- Can beconsultantof the area of knowledge (AoK) within sites and IFX globally
- Be themultiplierof the AoK in technical ladder (TL) community
- Lead technical critical paths for the DEV related projects and AoK attention within sites
Your profile
Qualifications and skills to help you succeed
You strive to leverage deep expertise in dispensing and jetting technologies, underfill and adhesive processes, and advanced packaging applicationsto drive process development, industrialization, yield improvement, and manufacturing excellence. You demonstrate strong technical leadership, analytical thinking, and data-driven problem-solving capabilities, utilizing process control, DOE, material science, automation, and Industry 4.0 principles to deliver innovative and scalable manufacturing solutions.
- Masters/Bachelor's Degreein Engineeringor relevant course with 12 years of experience in semiconductor, advanced packaging, or SMT manufacturingor >5 years in related dispensing and jetting process professional
- Strong hands-on experience in Dispense and jetting technologies, Underfill and adhesive processes, Fine-pitch / high-density applications
- Proven track record in Process development and industrialization, Yield improvementanddefect reduction, Cross-functional technical leadership, Statistical data analysis including design of experiment
- Understanding of below, an added advantage including:Fluid dynamics and rheology, Material science (adhesives, solder paste, encapsulants), Process control and DOE
- Familiarity withAdvanced packaging (SiP, flip chip, AI modules), Inline inspection systems, Automation and Industry 4.0 tools
- Goodanalytical and problem-solving skills
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.
Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.
Please let your recruiter know if you need any accommodations during the interview process.
Learn more about our various contact channels and about Diversity & Inclusion at Infineon.
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