Principal Engineer Cross Platform Technology Integration

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Cross Platform Technology Integration, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role
Key responsibilities in your new role

In this role, you willharmonize Technology Integration activities across multiple platforms, driving synergy through the implementation ofbest practicesand thesharing of technical expertise. You will provide Technology Integration leadership forcross-platform technology projects, ensuring alignment, effective collaboration, and successful execution of key development objectives.

• Act as a TI leadfornew technologyinvolving more than one platforms
• Responsible in PBC and TPC assessment
• Owner of Risk Interaction assessment and mitigation work packages
• Integration ownership ofPre-development fornew Chip technology that involved multiple platforms
• Harmonize the Integration of unit processes (BOM and Process) and new chip technology involving different package platforms
• Working partner forFE in FE/BE interactionand integration topics
• Act as adriver/team member for8D/problem-solvingfor interaction issues
• Drive synergy, best practice implementation andsharing of lesson learnt across platforms
• Provide technical guidance/assistance when needed in the projects related to interaction topic

Your profile
Qualifications and skills to help you succeed 

You strive to leverage your strong expertise in semiconductor packaging, assembly, testing, and technology interactionsto driveeffective collaboration, problem-solving, and technical integration across diverse stakeholders and platforms. You demonstrate proficiency in structured methodologies such as8D, DFMEA/PFMEA, DOE, and reliability analysis toi****dentify risks, optimize processes, and deliver robust engineering solutions.

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)
• At least 10 years of working experience inIC/semiconductor environment
• Strong Semiconductor  Packaging,Assembly****and Testknowledge
• Good aptitude for communication, collaboration,negotiation, andsolution finding
• Experience inFE/BE and BE/BE Interactions
• Possess knowledge of 8D & T6s methodology
• Possess knowledge of DFMEA/PFMEA
• Experience in Internal Package analysis/ first level reliability
• Possess knowledge ofDOE & Comparative methods

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

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We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. 

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