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Principal Engineer Equipment Engineering (Wire Bond)

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Onsite

Principal Engineer Equipment Engineering (Wire Bond)

Infineon Technologies (Malaysia) Sdn Bhd

Principal Engineer Equipment Engineering (Wire Bond)

1 month ago

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Important information


Contract type:

Permanent

Location:

Malacca, Malaysia

Work mode:

Onsite

Published on:

16 September 2026

What they need


#WeAreIn for jobs that impact everyone's life. Help us shape the foundation that keeps Infineon’s production running – stable, safe, and ready for the future. As a Principal Engineer Equipment Engineering, your contribution ensures that innovation never stands still. Together, we make reliability our strongest asset. Are you in?

Your role
Key responsibilities in your new role

  • Drive andlead a technical teamto build planned maintenance definition to have comprehensive equipment maintenance and robustness preventive in place and timely
  • Drive andgather previous maintenance improvement activitiesas to ensure that new machine reaches its optimal performance much early than usual and, develop standard hardware and software to governance
  • Setand implement wire bond equipment govern direction; effective indicators, monitoring, driving equipment improvement in the defined area of responsibility
  • Setupand implement planned maintenance systematicto ensure comprehensive equipment maintenance routines that all equipment is safe to operate, with high availability and good reliability within targeted budget
  • Establish andimplement systematic equipment improvement, preventive maintenance, calibration, and implement countermeasures to prevent repetitive breakdowns
  • Serve as Equipment Governance owner from conceptualization, piloting, implementation, monitoring, improving, and sustaining
  • Monitor equipment stability by integrate equipment with APC tools or semi auto integration system
  • Responsible for implementingand executing equipment improvement topics to meet/exceed TCR
  • Responsible to develop, evaluate, and certify the Engineer and Technician team in according to the define competency model

Your profile
Qualifications and skills to help you succeed

  • Bacheloror MastersDegree in Mechanical/Electronics/Automation Engineering is preferred
  • At least 8 yearsof working experience in Semiconductor Industry (Wire bond process)
  • Deep knowledge in 8Dand DMAIC problem-solving methodology
  • Able todetectandmitigate risk early
  • Able to lead team to drive for results
  • Good communicator, able to work in cross-functional projects

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