Infineon Technologies (Malaysia) Sdn Bhd
Principal Engineer Equipment Engineering (Wire Bond)
1 month ago
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Important information
Contract type:
Permanent
Location:
Malacca, Malaysia
Work mode:
Onsite
Published on:
16 September 2026
What they need
#WeAreIn for jobs that impact everyone's life. Help us shape the foundation that keeps Infineon’s production running – stable, safe, and ready for the future. As a Principal Engineer Equipment Engineering, your contribution ensures that innovation never stands still. Together, we make reliability our strongest asset. Are you in?
Your role
Key responsibilities in your new role
- Drive andlead a technical teamto build planned maintenance definition to have comprehensive equipment maintenance and robustness preventive in place and timely
- Drive andgather previous maintenance improvement activitiesas to ensure that new machine reaches its optimal performance much early than usual and, develop standard hardware and software to governance
- Setand implement wire bond equipment govern direction; effective indicators, monitoring, driving equipment improvement in the defined area of responsibility
- Setupand implement planned maintenance systematicto ensure comprehensive equipment maintenance routines that all equipment is safe to operate, with high availability and good reliability within targeted budget
- Establish andimplement systematic equipment improvement, preventive maintenance, calibration, and implement countermeasures to prevent repetitive breakdowns
- Serve as Equipment Governance owner from conceptualization, piloting, implementation, monitoring, improving, and sustaining
- Monitor equipment stability by integrate equipment with APC tools or semi auto integration system
- Responsible for implementingand executing equipment improvement topics to meet/exceed TCR
- Responsible to develop, evaluate, and certify the Engineer and Technician team in according to the define competency model
Your profile
Qualifications and skills to help you succeed
- Bacheloror MastersDegree in Mechanical/Electronics/Automation Engineering is preferred
- At least 8 yearsof working experience in Semiconductor Industry (Wire bond process)
- Deep knowledge in 8Dand DMAIC problem-solving methodology
- Able todetectandmitigate risk early
- Able to lead team to drive for results
- Good communicator, able to work in cross-functional projects
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