Principal Engineer (Integration Yield Defect)

• Supervise YDD Associate Engineers and wafer tech operators to ensure smooth 24/7 inline shift operation
• Train and certify DO Associate Engineers on recipe creation and defect source knowledge
• Maintain and enhance internal SOP/CAS and involve in internal;/external audit
• Operate FIB/SEM/EDX for inline failure analysis
• Operate and create recipes in Brightfield, Darkfield and other YDD tools
• Maintain and housekeep Brightfield, Darkfield and recipes of other YDD tools
• Perform partition analysis on defect source and detailed reports on issues
• Build and develop defect source library and tool’s defect source fingerprinting
• Track inline defect performance by layer/process tool/chamber on weekly basis
• Perform killer ration analysis
• Perform defect characterization by process tools
• Continuous improvement activities on defect reductions with Modules / vendors / equipment team
• Liaise with process engineers in different modules to troubleshoot for inline defects and defect reduction activities
• Provide scan support in low yield investigation & co-work with PI/YE/PE on technology & device specific yield enhancement activities
• Automate daily activities to improve troubleshooting speed of team
• Responsible for wafer quality to conform to product requirements and have the authority to stop shipment and stop production to correct quality problems

Job Requirements:

• Masters or Bachelor Degree in Electrical / Electronics / Chemical / Microelectronics Engineering

5-8 years of relevant work experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.- Familiar and experience in Defect analysis and yield enhancement in wafer process

• Excellent interpersonal and communication skills with good leadership capability
• Strong analytical skills and able to work under pressure in a fast pace environment
• Proficient with MS Power Point, Excel, Excel VBA, PowerBI