Hana Semiconductor (Ayutthaya) Co., Ltd.
Principal Engineer (Mgr. Level )Flip-chip technology or power packaging or SMT
Skills
1 month ago
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Important information
Contract type:
Permanent
Location:
Phra Nakhon Si Ayutthaya, Phra Nakhon Si Ayutthaya District, Phra Nakhon Si Ayutthaya, Thailand
Work mode:
Onsite
Published on:
9 September 2026
What they need
Principal Engineer ( Manager Level ) for Flip-chip technology or power packaging or SMT
Roles & Responsibilities
- Manage new product development ( Flip-chip technology and/or power packaging/or SMT ) and integrate process improvement.
- Lead NPI to ensure development of the technology and products are qualified with high level of quality.
- Design, execute ,analyze experiments and optimize current process to improve yield and performance of the new products.
- Manage engineering team, coordinate with assembly and test operation to improve yield and quality issues.
Requirements
- Working Location in Thailand
- Bachelor’s degree in Engineering in Electrical/Electronic or Science or related field
- Direct experiences for 8 years up (Flip-chip/Power packaging/SMT)
- Comprehensive knowledge on Semiconductor manufacturing process
- Strong verbal and written English communication skills.
- Strong reporting skills and statistical analysis.
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