Principal Engineer / MTS – Dry Etch (NAND Semiconductor)

About the role

We are looking for an experienced Principal Engineer / Member of Technical Staff (MTS) – Dry Etch to support advanced NAND process development and next-generation semiconductor technology.

Key responsibilities

• Develop and optimize advanced Dry Etch / Plasma Etch processes for NAND technology.
• Drive process development involving high aspect ratio etching, selective etch, profile control and CD management.
• Evaluate new plasma chemistries, process technologies and equipment/hardware.
• Develop and qualify advanced dry etch processes to improve performance, yield and manufacturability.
• Work closely with Process Integration, Thin Films, Wet Etch, Lithography, CMP, Diffusion and Device teams.
• Apply advanced analytics, statistical modelling and digital/AI tools to support process development.
• Provide technical leadership and collaborate with equipment/material suppliers.

About you

• Master's / PhD in Engineering, Materials Science, Physics, Chemistry or related discipline.
• Preferably 7–10+ years of relevant semiconductor process development experience.
• Strong hands-on expertise in ICP/CCP plasma etch / Dry Etch.
• Strong knowledge of plasma etch equipment, plasma-surface interaction, etch chemistry and profile control.
• Experience in advanced semiconductor / NAND process development.
• Experience with high aspect ratio etching, pattern transfer and/or selective etching is highly preferred.
• Familiarity with AI/ML, statistical modelling, data analytics or process automation is advantageous.
• Strong technical leadership, problem-solving and communication skills.
• Experience mentoring engineers or leading technical projects/teams is preferred.