Foxconn Interconnect Technology (FIT)
Principal Hardware Engineer
2 months ago
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Important information
Contract type:
Permanent
Location:
Irvine, CA, USA
Work mode:
Onsite
Published on:
8 August 2026
What they need
Job Title: Hardware Engineer, Principal
Job Location: Irvine, CA
Job Description:
The Engineer will design cable schematics based on DSP datasheets, handle PCB layout reviews and lead PCBA bring up ,including SMP inspection, power validation and side band testing.
Specific Duties to be Performed:
- Interpret DSP/retimer datasheets of pinout, power domains, reference clocks and I/O terminations.
- Design cable schematics including retimer power, EEPROM and CMIS interface. Perform PCB layout reviews
- Perform PCBA bring up : SMT inspection, voltage/current/thermal checks and sideband signal verification.
- Perform power-up sequencing and inrush current validation during prototype bring-up.
- Collaborate with DSP engineer for signal validation and margin verification.
Experience preferred:
- High-Speed Serdes(224G/112G PAM4, PCIe 6.0)
- Jitter and crosstalk analysis.
- Channel Loss Optimization
- Signal integrity (SI) & Power integrity (PI) Simulation
Education/Certification Preferred:
- 8+ Years in High-Speed Electrical Design or interconnect systems.
Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables, and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.
We offer our employees competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. FIT is an equal opportunity employer Minorities/Females/Protected Veterans/Disabled.
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