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Principal IO Mixed Signal Design Engineer

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Principal IO Mixed Signal Design Engineer

Connectpro Management Consultants

Principal IO Mixed Signal Design Engineer

Skills

Node

1 month ago

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Important information


Contract type:

Permanent

Salary:

₹7,000,000 – ₹9,500,000 / year

Location:

Hyderabad, Telangana, India

Work mode:

Onsite

Published on:

21 September 2026

What they need


Duties & Responsibilities

  • Responsible for the integration of mixed signal blocks in the IO, which includes generation of constraint files, floor planning and place and route of performance critical digital blocks in the IO signal path, and timing closure using STA.
  • Develop and integrate custom mixed signal circuits for high-speed DDR and other IO applications in advanced FinFET nodes. Experience in place and route, timing closure is required.
  • Work with the IO lead to understand the design requirements and translate them into circuit architectures, implement and simulate them.
  • Work closely with layout engineers on floorplan, placement and routing of their designs. Create efficient power delivery and signal routing topology to reduce congestion.
  • Deliver to the chip lead all collaterals such as Verilog and functional models, timing libraries, netlists for chip level integration.
  • Perform co-sim and AMS simulation to verify functionality of designs as and when necessary
  • Evaluate new design architectures and integration techniques to continuously improve the current and future IO design.
  • Support IO Mixed-Signal IP through post-tapeout phase, including lab testing, customer bring-up and debug

Requirements/Qualifications:

Experience Required

  • 10+ years of experience in place and route and timing closure of mixed signal blocks in complex SoC.
  • Experience with Virtuoso schematic capture tool.
  • Experience with Tempus, Innovus and other ASIC tools.

Requirements

  • Minimum of 10years of successful prior IO development and verification efforts.
  • Experience in ASIC methodology and familiarity with ASIC tools like Innovus and Tempus.
  • Competency in HSPICE, co-sim, and testbench generation and simulation.
  • Experience with Verilog coding
  • Knowledge about high-speed design techniques (DDRx, PCI-e, USB) and calibrations from an architectural and circuit design standpoint.
  • Demonstrated competency in scripting, managing simulation queues, and data capture plus presentation using Microsoft Office tools, including Excel.
  • Power analysis.
  • Good analytical, oral and written communication skills
  • Able to write clean, readable presentations.
  • Self-motivated, proactive team player.
  • Ability to work to schedule requirements.

Beneficial Experience

  • Experience with FPGA is preferred.
  • Experience with Memory interfaces and SerDes interfaces.
  • Familiarity with DFT and place and route.

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