Principal Power Semiconductor Device Engineer

ROLE PURPOSE:

Advanced Energy Malaysia is seeking a highly experienced Principal Power Semiconductor Device Engineer to serve as the technical authority for power semiconductor component failure analysis, root cause corrective action (RCCA), and reliability investigations across all Advanced Energy business units.

This role is responsible for leading complex investigations involving power semiconductor failures occurring in power supplies deployed in customer applications and manufacturing environments. The individual will interface closely with Customer Quality Engineering (CQE), Supplier Quality Engineering (SQE), Component Failure Analysis (CFA), Product Engineering, Design Engineering, Reliability Engineering, and Manufacturing teams to identify, validate, and eliminate root causes of semiconductor-related failures.

The Principal Engineer will provide deep technical expertise in silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) power semiconductor technologies, leveraging advanced device physics knowledge, failure analysis techniques, and stress-testing methodologies to determine failure mechanisms and drive effective corrective and preventive actions.

This position serves as the primary technical liaison between Advanced Energy, semiconductor suppliers, and electronics manufacturing partners for critical power semiconductor quality and reliability issues.

KEY RESPONSIBILITIES:

Power Semiconductor Failure Analysis & RCCA

• Lead complex root cause investigations involving MOSFET, IGBT, diode, rectifier, SiC, and GaN component failures.
• Drive 8D, RCCA, CAR, and CAPA activities associated with field returns, customer complaints, and manufacturing failures.
• Determine and validate failure mechanisms through analytical investigation and data-driven problem solving.
• Develop comprehensive technical conclusions supported by laboratory evidence, electrical characterization, and failure analysis results.
• Establish corrective and preventive actions to eliminate recurring semiconductor failure mechanisms.
• Present technical findings to executive management, customers, suppliers, and cross-functional teams.

Cross-Functional Technical Leadership

• Serve as the technical focal point between:

• Customer Quality Engineering (CQE)

• Supplier Quality Engineering (SQE)

• Component Failure Analysis (CFA)

• Product Engineering

• Manufacturing Engineering

• Reliability Engineering

• Strategic Suppliers

• Lead multidisciplinary problem-solving teams for high-impact customer and manufacturing issues.

• Drive closure of critical semiconductor quality escalations across all Advanced Energy business units.

• Mentor engineers in semiconductor failure analysis methodologies and root cause investigation techniques.

Semiconductor Device Physics & Failure Mechanism Analysis

• Analyze failures associated with:

• Silicon MOSFETs

• Superjunction MOSFETs

• SiC MOSFETs

• GaN HEMTs

• Power Diodes

• IGBTs

• Intelligent Power Modules (IPMs)

• Interpret failure analysis results and correlate findings to semiconductor device physics.

• Identify failures associated with:

• EOS (Electrical Overstress)

• ESD (Electrostatic Discharge)

• Thermal overstress

• Avalanche events

• Gate oxide breakdown

• Die attach degradation

• Bond wire failures

• Package-induced stresses

• Latch-up and transient events

• Parametric drift and wear-out mechanisms

• Correlate electrical, thermal, mechanical, and reliability data to identify true root causes.

Bench Stress Testing & Failure Replication

• Design and execute advanced laboratory stress tests to reproduce field and manufacturing failure modes.

• Develop test methodologies for:

• Power cycling

• Surge testing

• Avalanche testing

• SOA characterization

• High-voltage stress testing

• High-current stress testing

• Dynamic switching characterization

• Validate root cause hypotheses through controlled experimentation.

• Utilize electrical and thermal characterization tools to establish cause-and-effect relationships.

• Correlate bench test results with FA findings and field failure signatures.

Supplier Quality & Manufacturing Interface

• Work directly with semiconductor suppliers to resolve component quality and reliability issues.
• Review supplier failure analysis reports and corrective actions for technical adequacy.
• Participate in supplier audits and technical reviews when required.
• Drive containment, root cause determination, and corrective action implementation with suppliers.
• Interface with electronics manufacturing partners regarding assembly-related and process-induced failure mechanisms.
• Evaluate impacts of semiconductor fabrication, assembly, packaging, and test processes on product reliability.

Reliability Engineering Support

• Support qualification and reliability assessments for new semiconductor technologies and suppliers.

• Evaluate reliability risks associated with semiconductor devices and applications.

• Review and interpret results from:

• HTOL

• HTRB

• HTGB

• Temperature Cycling

• Power Cycling

• HAST

• THB

• Other JEDEC qualification tests

• Provide expert guidance on derating requirements, reliability margins, and lifetime expectations.

Power Supply Application Assessment

• Assess semiconductor failures resulting from:

• Application-specific stress conditions

• Design margin deficiencies

• Derating violations

• Abnormal switching behavior

• Transient events

• Thermal management issues

• Control-loop interactions

• System integration effects

• Collaborate with design teams to improve robustness and reliability.

• Recommend design improvements to prevent recurrence of identified failure mechanisms.

REQUIRED QUALIFICATIONS:

Education

• Bachelor's degree in Electrical Engineering (BSEE) or equivalent engineering discipline.
• Advanced degree (MSEE or PhD) preferred.

Experience

• Minimum 15 years of experience in power semiconductor device engineering, failure analysis, reliability engineering, product engineering, or semiconductor test engineering.
• Extensive experience with Si, SiC, and GaN power semiconductor technologies.
• Proven expertise leading semiconductor failure investigations and RCCA activities.
• Experience supporting field failures, customer quality issues, and supplier corrective actions.
• Strong background working with semiconductor manufacturers and electronics OEMs.
• Demonstrated success resolving complex, cross-functional technical issues involving power semiconductor devices.

TECHNICAL EXPERTISE (MUST-HAVE)

• Deep knowledge of semiconductor device physics.

• Expert understanding of:

• Silicon MOSFET technologies

• SiC MOSFET technologies

• GaN power devices

• Power semiconductor packaging technologies

• Strong expertise in failure analysis methodologies and interpretation of FA results.

• Comprehensive understanding of semiconductor fabrication processes.

• Strong understanding of wafer manufacturing and assembly operations.

• Expertise in package assembly technologies including:

• Wire bond packages

• Copper clip packages

• Power modules

• Transfer molded packages

• Knowledge of reliability qualification standards and methodologies.

• Strong understanding of power electronics applications and converter topologies.

• Experience with electrical characterization and device stress testing.

• Working knowledge of quality systems including:

• 8D

• RCCA

• CAR

• CAPA

• FMEA

• Control Plans

PREFERRED QUALIFICATIONS

• Experience within power electronics, semiconductor, industrial, or power conversion industries.

• Familiarity with semiconductor FA techniques including:

• SEM

• FIB

• EDX

• SAM

• X-Ray

• Decapsulation

• Curve Tracing

• Emission Microscopy

• Experience supporting global manufacturing operations.

• Experience qualifying new semiconductor suppliers and technologies.

• Lean Six Sigma Green Belt or Black Belt Certification.

• Experience with customer-facing quality and reliability reviews.

KEY COMPETENCIES & PERSONAL ATTRIBUTES:

• Technical Leadership: Recognized subject matter expert in power semiconductor devices and failure mechanisms.
• Root Cause Expertise: Ability to identify true physical root causes through analytical and experimental methods.
• Problem Solving: Exceptional capability in resolving complex cross-functional technical issues.
• Communication: Ability to communicate highly technical concepts to engineering teams, executives, customers, and suppliers.
• Influence: Drives alignment and action across multiple organizations without direct authority.
• Customer Focus: Strong commitment to customer satisfaction and issue resolution.
• Continuous Improvement: Proactively drives systemic quality and reliability improvements.

WHY JOIN US!!

BENEFITS :

As part of our total rewards philosophy, we believe in offering and maintaining competitive compensation and benefits programs for our employees to attract and retain a talented, highly engaged workforce.

Our compensation programs are focused on equitable, fair pay practices including market-based base pay, an annual pay-for-performance incentive plan, and etc. In addition to our competitive compensation practices, we offer a strong benefits package in each of the countries in which we operate. In Malaysia., we offer a rich benefits package that includes:

• Medical - health care plan, dental, and vision.
• Short and long-term disability and life insurance.
• Executive Employee Health Screening package.
• Generous paid time off starting at 15 days and 19 public holidays.
• 98 days of paid maternity leave for Moms and 7 consecutive days of paid paternity leave for Dads.
• AE Child-Of-Employee Scholarship Program.
• Employee Referral Program.
• Career Growth and Learning Opportunity.