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Process & Packaging Development Engineer - Electronics

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Onsite

Process & Packaging Development Engineer - Electronics

PT Michael Page Internasional Indonesia

Process & Packaging Development Engineer - Electronics

Skills

RCompliance

2 months ago

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Important information


Contract type:

Permanent

Location:

Batam, Batam City, Riau Islands, Indonesia

Work mode:

Onsite

Published on:

7 August 2026

What they need


Join a global technology manufacturer to lead the development and industrialization of advanced packaging processes for electronic products. This role combines process development, simulation, supplier engagement, and cross-functional project leadership to bring new manufacturing technologies into production.

Client Details

Our client is a multinational technology manufacturer developing advanced sensing solutions for industrial applications. The company is investing in new packaging technologies and is seeking experienced engineering talent to support this strategic initiative.

Description

We are seeking an experienced engineering professional to drive the development and implementation of advanced packaging and assembly processes for our client's products.

Key responsibilities include:

  • Develop and optimize transfer molding and packaging processes from prototype through mass production.
  • Lead process industrialization activities, including process flow design, qualification, validation, and continuous improvement.
  • Conduct engineering simulations and analysis to support product and process development.
  • Evaluate and select materials, equipment, and external manufacturing partners.
  • Manage technical collaboration with suppliers, subcontractors, and internal stakeholders.
  • Support new product introduction (NPI) activities and customer-specific requirements.
  • Work closely with manufacturing, procurement, quality, tooling, and R&D teams to ensure successful project execution.
  • Drive technical problem-solving and provide recommendations for process and product improvements.
  • Ensure compliance with quality and reliability requirements for industrial and automotive applications.

Profile

  • 10+ years of engineering experience in semiconductor, electronics, packaging, or related manufacturing environments.
  • Strong hands-on experience with transfer molding technology and process development.
  • Experience in assembly, packaging, encapsulation, or back-end manufacturing processes.
  • Experience using engineering simulation tools (Ansys preferred).
  • Proven track record of leading process development, industrialization, or NPI projects.
  • Strong stakeholder management and project coordination skills.
  • A minimum of Bachelor's in Engineering, Materials Science, Physics, Microsystems Technology, or related fields.
  • Knowledge of FMEA, DOE, APQP, PPAP, MSA, and quality management methodologies.
  • Experience managing external manufacturing partners or subcontractors.
  • Mandarin language capability is preferred.

Job Offer

  • Opportunity to become a key technical expert in a strategically important new technology area.
  • Highly visible role with direct influence on future manufacturing capabilities and product roadmaps.
  • Exposure to end-to-end process development, from R&D and simulation through production ramp-up.
  • Extensive collaboration with global stakeholders, suppliers, and manufacturing partners.
  • Chance to build and shape a new process platform rather than maintain an existing one.

To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Jessica Kurniawan on [+62 21 2958 8814](tel:+62 21 2958 8814).

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