Mini-Circuits Technologies (Malaysia) Sdn Bhd
Process Development Engineer (Wire Bond)
1 month ago
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Important information
Contract type:
Permanent
Location:
George Town, Penang, Malaysia
Work mode:
Onsite
Published on:
24 September 2026
What they need
Primary Functions:
- To provide process sustenance and improvement for wire bond in production, die sales and NPI process development.
Duties/Job Responsibilities:
- Employ quantitative problem solving and corrective action methods.
- Apply FMEA tools to develop risks assessment matrix to develop effective process control with simplify procedures.
- Implement and utilize statistical process control tools as required.
- Make sound technical toward positive business recommendation.
- Document processes, procedures, and methods as required.
- Promote teamwork and cooperation among technicians and associate engineers.
- Observe and ensure safety requirements.
- Train operators and technicians as required.
- Specify, select and qualify/buyoff assembly equipment.
- Develop, qualify, improve and monitor/control new processes buyoff.
- Work with equipment technical team to design fixtures for assembly and test processes as required.
- Select, evaluate, and qualify new materials, designs and processes as required.
- Coach and guide associate engineer and technician in their daily routines and activities.
- Initiate product yield improvement projects.
- Understanding of basic Failure Analysis
- Manufacturing cycle time improvement.
- 5S housekeeping.
- Any other job responsibilities assigned by the supervisor as and when required.
Qualifications/Requirements:
- Bachelor’s Degree or its equivalent in relevant fields of Manufacturing, Engineering or Applied Science, or Diploma holder with minimum 2-3 years experience
- Preferably with 2-3 years experience in wire bond experiences
- Related software and AutoCad knowledge is an added advantage
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