Process Engineer - Advanced Packaging

Fabrinet West - Santa Clara, CA, United States

PURPOSE:

• To support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)

PRINCIPLE ACCOUNTABILITIES / DUTIES:

• Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.

• Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.

• Create, improve and document optical splicing and routing for fiber optics box build assembly.

• Lead root cause analysis and corrective actions for process excursions.

• Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.

• Design and order necessary tooling and ensure availability of all consumables

  PREVIOUS EXPERIENCE REQUIRED: (include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)

  PREFERRED Qualifications (nice to have skills): 0-1 year experience in cleanroom manufacturing environment

  Understand principle for die bonding in microelectronics

  Basic Programming python, Excel for data analysis Education or Training: · BS degree required in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Optical Engineering, or Physics.

Compensation $120-$140k/annually

Posted: Monday, September 28, 2026

Job # 832