Process Engineer (AOI)

About the role

Solve daily production issues through strong problem-solving abilities and practical solutions to ensure the efficiency and quality of manufacturing process. Solutions typically result in improved products, processes or quality. Provide leadership to make a difference.

Key responsibilities

Develop and optimize process to improve accuracy, cycle time, and overall efficiency

Identify and resolve issues related to process equipment, software, and results to maintain smooth production flow

Create process documentation to ensure process and product quality assurance and conduct analysis of process data, and implement corrective actions

Propose and implement continuous improvement initiatives to enhance process capabilities

Work closely with Process Engineering, Manufacturing and Quality Assurance & NPI team to ensure seamless integration of process into production

Support new product/process qualification build

Track product quality performance

New product recipe setup per Process Engineer Requirement

About you

Capability to interpret data and make data-driven decisions to enhance production efficiency and quality

Ability to quickly learn new technologies and willingness to work collaboratively in a dynamic manufacturing environment with excellent verbal and written communication skills

Ability to analyze complex issues, identify root causes, and implement effective solutions

Proficiency in Microsoft Word, Excel (basic data analysis, formulas), and PowerPoint (basic presentation skills)

Familiar on CAMTEK AOI machine will be in advantage

Strong focus in data analysis and ADC algorithm system performance, ensuring accuracy and reliability

Minimum Diploma in Engineering (Entry Level)

Join a leader in the industry!

STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.

Join us and expand your world.