Process Engineer-Assembly （optical module）

About the role

Lead new product introduction (NPI) activities including design for manufacturability (DFM) and design for assembly (DFA) reviews, process flow design, parameter window definition, and fixture/equipment selection and acceptance. Control core assembly processes including SMT/reflow, Hotbar bonding, TO/BOX-to-PCBA soldering, fiber/lens alignment, epoxy dispensing and curing, hermetic sealing, laser welding, and wire bonding.

Key responsibilities

• Lead NPI: DFM/DFA review, process flow design, parameter window definition, fixture/equipment selection and acceptance
• Develop and maintain full process documentation: SOPs, WIs, PFMEA, Control Plans, flowcharts
• Control core assembly processes: SMT/reflow, Hotbar bonding, TO/BOX-to-PCBA soldering, fiber/lens alignment, epoxy dispensing and curing, hermetic sealing, laser welding, wire bonding
• Monitor yield, FR, CPK, OEE via SPC; apply DOE, 8D, RCA to resolve defects and drive continuous improvement
• Manage material/design changes (ECN/PCN), validation, and smooth production transition
• Collaborate with QA/R&D/SCM on failure analysis, reliability verification, supplier qualification, and customer corrective actions
• Train production teams; enforce cleanroom, ESD, and laser safety compliance

About you

• Bachelor's degree or above in Electronics, Optics, Materials, Mechanical, Microelectronics, or Packaging
• 3+ years direct experience in optical module/component assembly process
• Deep knowledge of TOSA/ROSA/BOX/transceiver assembly and key equipment (aligners, bonders, dispensers, welders)
• Proficient in PFMEA, Control Plan, SPC, DOE, 8D, RCA; skilled with Minitab, Office
• Familiar with inspection tools (microscope, X-Ray, pull tester)
• Familiarity with GR-468, Telcordia, and optical reliability standards
• Fluent in English for technical documents
• Experience with 400G/800G/CPO/silicon photonics or active alignment is a strong plus