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Process Engineer - CMP

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Onsite

Process Engineer - CMP

SCHOTT Glass (M) Sdn Bhd

Process Engineer - CMP

Skills

Data Analysis

16 days ago

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Important information


Contract type:

Permanent

Salary:

MYR 60,000 – MYR 78,000 / year

Location:

Kulim, Kedah, Malaysia

Work mode:

Onsite

Published on:

4 October 2026

What they need


About the role

Responsible for developing, qualifying, and launching new polishing processes to support New Product Introduction (NPI) and production ramp-up.

Key responsibilities

  • Lead process development, qualification, and release for new polishing applications.
  • Responsible for defining and achieving sub-milestones and deliverables for projects within the larger timelines of the overall program needs.
  • Responsible in defining manufacturing concepts including equipment concept, process flow, process requirement profile, and technical specifications.
  • Translate product design and surface quality requirements (Ra, TTV, flatness, etc.) into robust polishing process parameters.
  • Design and execute DOE (Design of Experiments) for process characterization and optimization.
  • Develop process documentation including Process FMEA, process flow diagram, process qualification report, work instructions, control plans, and OCAP.
  • Support pilot runs and process transfer to manufacturing.
  • Optimize surface quality through parameter tuning.
  • Conduct root cause analysis (RCA) and implement corrective/preventive actions (CAPA) for yield and quality issues.
  • Drive continuous improvement in process capability, first-pass yield, and cost efficiency.

About you

  • 3–5 years of experience in precision polishing, CMP, or surface finishing for glass, wafer, or optical components
  • Proven background in NPI process development and process transfer to mass production.
  • Hands-on experience with double-sided / single-sided polishing, lapping, or CMP equipment.
  • Familiar with metrology and surface characterization tools (interferometer, AFM, stylus profiler, microscope, surface scanner).
  • Strong understanding of polishing mechanics, and chemical-mechanical interactions.
  • Proficiency in Minitab / JMP / SPC tools for data analysis and process capability studies.
  • Knowledge of lean manufacturing, Six Sigma, and FMEA methodologies.
  • Excellent analytical, communication, organizational, and problem-solving skills.
  • BSc/MSc/PhD Degree in Mechatronics / Material Engineering / Chemical Engineering / Physics / Optics
  • Able to manage multiple NPI projects in parallel with tight timelines.

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