Process Engineer

About the role

We are seeking an experienced Underfill Process Engineer to develop and optimize advanced underfill solutions for System-in-Package (SiP) products. You will lead capillary and molded underfill process development, dispensing-equipment optimization, material evaluation, defect reduction, and manufacturing yield improvement. This role offers the opportunity to work on advanced semiconductor packaging technologies and collaborate closely with R&D, product design, manufacturing, equipment, suppliers, and quality teams.

Key responsibilities

• Develop, qualify, and optimize capillary and molded underfill processes for SiP and flip-chip products.
• Establish process parameters for dispensing, material flow, curing, fillet formation, and coverage.
• Program and maintain automated dispensing platforms, including Nordson ASYMTEK or equivalent systems.
• Evaluate underfill materials based on viscosity, flow performance, Tg, CTE, modulus, adhesion, cure profile, and reliability.
• Apply DOE, statistical analysis, and process capability studies to define robust operating windows.
• Investigate and eliminate defects such as voids, delamination, incomplete coverage, filler separation, overflow, and die contamination.
• Conduct failure analysis using CSAM, X-ray, cross-sectioning, microscopy, and other analytical techniques.
• Improve yield, cycle time, material utilization, equipment uptime, and overall manufacturing performance.
• Prepare process specifications, control plans, work instructions, qualification reports, and technical documentation.
• Support new-product introduction, process transfer, equipment qualification, and production ramp-up.

About you

• Bachelor's in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, or a related discipline.
• At least 3 years of relevant experience in semiconductor assembly, advanced packaging, underfill, encapsulation, or precision fluid dispensing.
• Strong understanding of flip-chip assembly, capillary flow, polymer behavior, curing mechanisms, and package reliability.
• Hands-on experience with automated dispensing equipment; Nordson ASYMTEK experience is highly preferred.
• Practical knowledge of underfill material properties, including viscosity, Tg, CTE, modulus, adhesion, moisture sensitivity, and flow rate.
• Experience using CSAM, X-ray inspection, cross-sectioning, microscopy, and other failure-analysis methods.
• Proficiency in DOE, SPC, statistical analysis, process capability, root-cause analysis, and corrective-action methodologies.
• Experience in process qualification, equipment validation, new-product introduction, and high-volume manufacturing.
• Strong analytical, troubleshooting, documentation, and cross-functional communication skills.