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Process Engineer

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Onsite

Process Engineer

SUPERSIC (MALAYSIA) SDN. BHD.

Process Engineer

Skills

Compliance

1 month ago

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Important information


Contract type:

Permanent

Salary:

MYR 48,000 – MYR 66,000 / year

Location:

George Town, Penang, Malaysia

Work mode:

Onsite

Published on:

17 September 2026

What they need


Job responsibilities

-          Process Monitoring & Data Ownership: Own, track, and stabilize daily wafer fabrication logs, yield parameters, and advanced machine error codes across critical SiC processing zones.

-          Tool Commissioning & Parameter Baselines: Lead the engineering team during advanced tool commissioning, establishing rigorous parameter baselines, and optimizing test wafer sampling methodologies.

-          Advanced Process Characterization Studies: Spearhead the compilation and statistical modeling of complex manufacturing data for high-level process characterization studies, while structuring the electronic recipe databases.

-          Cleanroom Operational Discipline & Audits: Drive absolute cleanroom compliance by managing and conducting structural 5S, safety, and operational hygiene audits within critical sub-micron processing zones.

-          Yield Enhancement & Variation Reduction Projects: Spearhead structured process optimization projects leveraging advanced engineering principles to systematically reduce crystalline process variation, eliminate yield excursions, and minimize material waste.

Job Requirements

  • Academic Qualification: MUST possess a Master's Degree (M.Sc. or M.Eng.) in Material Science, Chemical Engineering, Applied Physics, Mechatronics, Microelectronics, Electronic/Electrical Engineering, or equivalent applied science branches. (Applications without a Master’s qualification will be automatically filtered).
  • Academic Excellence: Maintained a continuous CGPA of 3.00 and above throughout both Bachelor’s and Master’s degree levels.
  • Technical Asset: Prior research or internship experience (3–6 months) inside a wafer fab cleanroom environment (e.g., thin films, polishing, crystal growth, or lithography) or an automated cleanroom thesis project is a major advantage.
  • Core Technical Competencies: Strong fundamental knowledge of material characterization, thin-film mechanics, fluid dynamics, or semiconductor physics. Familiarity with SPC, DOE, and Minitab is highly preferred.
  • Language Capabilities: Fluent and articulate command of both written and spoken English.

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