Process Engineer

Job Descriptions:

• Responsible for PCBA process and yield improvement. Drive process control, failure analysis and problem solving involving PCB assembly and soldering material.
• Responsible for new process and equipment technology improvement. Utilize Six Sigma methodology to identify critical parameter, analyze process gap and develop new process/ equipment technology to leap frog the current manufacturing capability.
• Support scrap and waste elimination initiative. Drive error-proof solutions involving fixture design and automation to reduce human dependency and streamline process flow.
• Support new product introduction and transfer. Utilize DFM tools to assess new product and ensure meeting manufacturing design guideline and best practices for flawless launch.

Job Requirement:

• Candidate must possess a Bachelor’s/ Master’s degree preferably in Manufacturing/ Industrial/ Mechanical/ Material Engineering with 2nd Class Upper or equivalent.
• Experience in Surface Mount Technology will be an advantage.
• Knowledge in Material/ Metallurgy Failure Analysis (SEM, EDX etc) will be an advantage.
• Knowledge in Statistical and Lean Six Sigma Methodology will be an advantage.
• Knowledge in DFM with good understanding of PCB design guidelines will be an advantage.
• Good interpersonal skills and ability to work independently in a dynamic environment