Process Engineer

About the Role

We are seeking a highly motivated Process Engineer to support process optimization, yield improvement, and continuous improvement initiatives within a semiconductor or PCB manufacturing environment. The successful candidate will be responsible for driving process stability, troubleshooting manufacturing issues, supporting new product introduction (NPI), and ensuring production targets are achieved while maintaining the highest quality standards.

Key Responsibilities

• Monitor and optimize manufacturing processes to improve yield, quality, and productivity.
• Analyze process data and identify opportunities for process improvement and cost reduction.
• Investigate process abnormalities and lead root cause analysis activities.
• Implement corrective and preventive actions (CAPA) to prevent recurrence of issues.
• Support New Product Introduction (NPI), process qualification, and engineering trials.
• Develop and maintain process documentation, specifications, work instructions, and control plans.
• Collaborate with Production, Quality, Equipment, and R&D teams to resolve technical issues.
• Monitor key process parameters and ensure compliance with operational standards.
• Lead continuous improvement projects using Lean, Six Sigma, or other improvement methodologies.
• Evaluate process capability and implement measures to enhance manufacturing performance.
• Support customer audits, internal audits, and quality improvement initiatives.
• Ensure compliance with quality systems, safety requirements, and company policies.

Requirements

• Bachelor's Degree in Engineering (Chemical, Mechanical, Manufacturing, Materials, Electronics, Semiconductor, or related field).
• Minimum 3 years of working experience in Semiconductor or PCB Manufacturing.
• Experience in process optimization, yield improvement, and manufacturing troubleshooting.
• Knowledge of SPC, FMEA, 8D, CAPA, DOE, and Root Cause Analysis methodologies.
• Experience supporting NPI activities, process qualification, and engineering evaluations.
• Strong analytical, problem-solving, and data interpretation skills.
• Familiarity with manufacturing quality systems and process control methods.
• Good communication skills and ability to work effectively with cross-functional teams.
• Proficient in Microsoft Office and engineering data analysis tools.

Preferred Qualifications

• Experience in IC Substrate, PCB, Semiconductor Packaging, Wafer Fabrication, or Electronics Manufacturing.
• Knowledge of Minitab, JMP, or statistical analysis software.
• Exposure to Lean Manufacturing and Six Sigma methodologies.
• Experience in high-volume manufacturing environments.

Pay: RM3,500.00 - RM8,100.00 per month

Benefits:

• Additional leave
• Dental insurance
• Flexible schedule
• Free parking
• Health insurance
• Maternity leave
• Meal allowance
• Opportunities for promotion
• Parental leave
• Professional development
• Vision insurance

Work Location: In person