Process Engineer

About the role

This role involves developing, characterizing, optimizing, qualifying, and sustaining high-precision die-bonding and die-attach processes. You will own key process parameters including placement and alignment accuracy, bonding force, temperature and time, bond-line thickness, material selection, tooling, and collet design. You will define process windows, control methods, acceptance criteria, and capability requirements for critical process characteristics, and provide technical leadership in resolving complex die-bonding process and equipment challenges.

Key responsibilities

• Develop, characterize, optimize, qualify, and sustain high-precision die-bonding and die-attach processes
• Own key process parameters, including placement and alignment accuracy, bonding force, temperature and time, bond-line thickness, material selection, tooling, and collet design
• Define process windows, control methods, acceptance criteria, and capability requirements for critical process characteristics
• Evaluate process, material, and equipment performance using engineering data and statistical analysis
• Identify and implement new process concepts, equipment technologies, automation solutions, and manufacturing approaches
• Transfer new products from R&D to contract manufacturers, ensuring process readiness and successful production ramp-up
• Support design-for-manufacturability activities and provide process feedback to R&D during early product development
• Plan and execute engineering builds, First Article Inspections, process characterization, contract manufacturer qualification, process validation, and manufacturing-readiness activities
• Develop and maintain manufacturing documentation, including work instructions, process specifications, control plans, and process-flow documents
• Analyze manufacturing data, SPC trends, yield performance, process capability, and defect data to identify improvement opportunities

About you

• Bachelor's degree or higher in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Mechatronics, Physics, Applied Physics, or a related technical field
• Typically 10+ years of relevant experience, with demonstrated technical leadership and ownership of complex manufacturing processes
• Strong manufacturing engineering experience with optoelectronic devices, optical modules, or precision assembly
• Experience with new product introduction (NPI), process development, product qualification, and product transfer to high-volume manufacturing
• Hands-on experience developing, optimizing, and sustaining high-precision die-bonding or die-attach processes
• Strong knowledge of statistical process control (SPC), process capability analysis (Cp/Cpk), design of experiments (DOE), statistical data analysis, and structured problem-solving
• Experience working with contract manufacturers, equipment suppliers, and cross-functional engineering teams
• Strong written and verbal English communication skills
• Willingness and ability to travel internationally as required