Process Engineer - Copper Electroplating

🔬 Process Engineer - Copper Electroplating

🌎 Phoenix, Arizona

🚀 Start-up semiconductor company

Strong Salary + Equity opportunities + 401k match

This is an incredible opportunity to work on cutting-edge technology which is changing the semiconductor industry.

This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies.

This company is creating a new fabrication process which can improve the compute ability of chips considerably.

After receiving strong funding and HUGE amounts of industry interest, they are adding to their R&D function in the form of a Process Engineer for Copper Plating.

Translating lab-scale processes into stable , repeatable manufacturing workflows is critical for this opportunity.

Some requirements & additional info.

Degree in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering

5+ years of hands-on experience in electroplating or electrochemical process development

Support process transfer to pilot lines and external fabrication partners

Strong experience with copper electroplating or similar metal deposition systems

Background in semiconductor manufacturing, advanced packaging.

Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments

If you'd like to find out more, please apply via the link provided / email me at 📩 [email protected]