Process Engineer (Diffusion / Photo / Thin Film / Etch)

Job Purpose:

• Sustain and improve process / SPC to meet quality, cost, productivity requirements

Job Descriptions:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK
• Review ESPC charts using SPACE. Know all the rules for ESPC
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE
• Create SPC charts, DCOP and modify SLDB using PROMIS (CAMSTAR)
• Upload recipe, check recipe and ensure recipe content compliance using RMS
• Raise PCRB and understands the requirements for PCRB opening, follow through with qual plan, analyze data using required software and CR closure
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN
• Setup and troubleshoot issues in recipes/job files in all metrology tools within the Module. Do regular housekeeping of production job files
• Follow up on pass down to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required
• Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run
• Work on reducing process constraints so that Mfg can have more flexibility
• Perform process matching between equipment to reduce variation and analysis / DOE to find factors for better tool matching
• Participate in CIP programs to optimize process window, cost, yield, and productivity
• Work as a team with both Equipment and Mfg Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals
• Represent own Module to attend cross-functional task team to address yield improvement / excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs
• Follow good housekeeping and safety rules in office and Fab
• Provide feedback/training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment
• Provide monthly report to Supervisor
• Participate in wafer scrap reduction. Ensure no human error
• Responsible and accountable for complying with and implementing environmental, health, safety and security (EHSS) system, policies, procedures and guidelines that are applicable to your scope of work, thereby maintaining a healthy and safe workspace

Requirements:

• Degree in Electrical / Electronics /Microelectronics / Chemical Process Engineering / Chemistry / Physics related major
• Diploma holders 3 years working experience in Semiconductor Front-End Process
• Perform Normal/ Swing Shift ( or 12-hour rotating shift if required
• Good interpersonal skills and is an excellent team player
• Good verbal and written communication skill
• Logical thinking capability and good analytical skill
• High level of integrity with leadership attribute
• Highly committed with good ownership and accountability
• Passion for the semiconductor / manufacturing industry