Process Engineer II (Assembly/NPI)

• Own assigned manufacturing processes to achieve yield, quality, productivity, and cost targets.
• Drive process optimization, troubleshooting, root cause analysis, and continuous improvement initiatives.
• Serve as the process engineering focal point for NPI programs & support process qualification, validation and production ramp-up activities.
• Review manufacturing readiness including process capability, tooling, equipment, materials, capacity, and documentation.
• Identify and drive closure of technical, operational, quality, and cost-related gaps prior to production release.
• Coordinate with Product Engineering, Quality, Manufacturing, Equipment Engineering, and Supply Chain teams to ensure successful product introductions.
• Develop and maintain process documentation, control plans, and risk assessments.
• Provide readiness recommendations and risk assessments to management for production release decisions.

Qualifications

• Bachelor's Degree in Mechanical, Materials, Manufacturing, Electrical, Mechatronics, Chemical Engineering, or related discipline.
• 2-5 years of semiconductor manufacturing, process engineering, NPI, package development, or product engineering experience.
• Experience with semiconductor assembly or backend manufacturing processes.
• Familiar with NPI, process qualification, and production ramp activities.
• Knowledge of DOE, SPC, MSA, FMEA, Control Plan, 8D, and structured problem solving.
• Experience in yield improvement, process optimization, and cost reduction projects.
• Strong analytical and data-driven decision-making capability.
• Good project coordinating skills & manage stakeholders across multiple functions.
• Experience in NPI handoff/handshake, manufacturing readiness assessment, product transfer, or production ramp-up will be an added advantage.
• Experience in Mold process is an advantage.