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Process Engineer — III-V Semiconductor / Laser Wafer Fab

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Onsite

Process Engineer — III-V Semiconductor / Laser Wafer Fab

Glint Tech Solutions

Process Engineer — III-V Semiconductor / Laser Wafer Fab

1 month ago

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Important information


Contract type:

Permanent

Location:

South Plainfield, NJ 07080, USA

Work mode:

Onsite

Published on:

10 September 2026

What they need


Position Overview

We are seeking a Process Engineer to support and develop advanced III-V semiconductor laser wafer fabrication processes. The role will focus on InP BH laser fabrication, including photolithography, etching, film deposition, wafer cleaning, metrology, and process control.

Key Responsibilities

  • Support InP BH laser wafer fabrication processes.
  • Work with photolithography, holographic grating, film deposition, dry/wet etching, and wafer cleaning processes.
  • Monitor manufacturing processes using SPC and other process-control methods.
  • Troubleshoot fabrication and process issues.
  • Drive continuous process and yield improvements.
  • Partner with device design engineers on DOE and new process development.
  • Develop metrology methods to monitor and characterize wafer processes.
  • Analyze process data and prepare engineering reports.
  • Support process equipment maintenance and work with equipment suppliers.
  • Develop work instructions and provide technical training to production technicians.

Qualifications

  • M.S. or Ph.D. in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or related discipline.
  • 1–3 years of semiconductor fab experience.
  • Hands-on experience with:
    • Photolithography
    • Dry/wet etching
    • Wafer cleaning
  • Experience with semiconductor process development, troubleshooting, and process control.
  • Familiarity with characterization tools such as:
    • SEM
    • EDS
    • Ellipsometer
    • Profilometer
  • Experience with III-V / InP / photonics / semiconductor laser fabrication is highly preferred.

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