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Process Engineer – Leadframe Process & Tooling Expert

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Onsite

Process Engineer – Leadframe Process & Tooling Expert

STMicroelectronics

Process Engineer – Leadframe Process & Tooling Expert

Skills

Process ImprovementCompliance

2 months ago

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Important information


Location:

Muar, Johor, Malaysia

Work mode:

Onsite

Published on:

28 August 2026

What they need


OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 122 nationalities, present in 40 countries, and comprising over 49,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

The Process Engineer – Leadframe Process & Tooling Expert is responsible for the development, optimization, and sustaining of assembly leadframe processes, with primary ownership of Lead Lock Tape and Lead Trimming operations. The role ensures process robustness, tooling readiness, yield improvement, equipment performance, and continuous manufacturing excellence in a high-volume semiconductor assembly environment

  • Own and sustain Lead Lock Tape and Lead Trimming assembly processes.
  • Define, optimize, and troubleshoot process parameters to ensure stable output, high yield, and product quality.
  • Support tooling design, qualification, modification, and troubleshooting for leadframe and assembly operations.
  • Investigate process and tooling issues, identify root causes, and implement effective corrective and preventive actions.
  • Lead process improvement activities using structured problem-solving and data-driven methods.
  • Support new product introduction (NPI) , process transfer, qualification, and ramp-up activities.
  • Collaborate with Production, Quality, Equipment, Maintenance, and Tooling teams to resolve technical issues.
  • Conduct process capability analysis, DOE, SPC, and yield loss studies.
  • Drive scrap reduction, cycle time improvement, productivity enhancement, and cost reduction initiatives.
  • Maintain and update process documentation such as SOPs, control plans, specifications, and troubleshooting guides.
  • Support vendor coordination for tooling development, repair, and technical improvement.
  • Ensure compliance with safety, quality, and manufacturing standards.
  • Train and coach operators, technicians, and junior engineers on process best practices

YOUR SKILLS & EXPERIENCES

Required Qualifications

  • Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, Material Science, or a related technical field.
  • Minimum 5 years of experience in semiconductor assembly or manufacturing process engineering.
  • Strong hands-on experience in leadframe process engineering.
  • Proven experience with Lead Lock Tape and/or Lead Trimming processes.
  • Demonstrated background in tooling support, troubleshooting, and process optimization.
  • Experience supporting high-volume manufacturing environments.
  • Strong knowledge of process control tools such as SPC, DOE, FMEA, 8D, 5 Why, Fishbone Analysis.
  • Ability to interpret data and drive decisions using analytical tools such as Excel, Minitab, or equivalent.

Preferred Qualifications

  • Experience in semiconductor back-end assembly operations.
  • Exposure to leadframe stamping, plating, trimming, and forming processes.
  • Experience in tooling qualification with equipment suppliers or vendors.
  • Knowledge of Lean Manufacturing and Six Sigma methodologies.
  • Experience in customer issue resolution and reliability-related investigations.

Skills and Competencies

  • Strong analytical and problem-solving skills.
  • Hands-on technical mindset with strong ownership.
  • Good communication and cross-functional coordination skills.
  • Ability to work independently and manage multiple priorities.
  • Strong attention to detail and process discipline.
  • Continuous improvement mindset.

Key Performance Indicators

  • Process yield improvement
  • Reduction in scrap, defects, and rework
  • Tooling uptime and process stability
  • Successful NPI qualification and ramp-up
  • Cost reduction and productivity improvement
  • Effective closure of process and tooling issues

Working Conditions

  • This role is based in a manufacturing/assembly environment.
  • May require frequent presence on the production floor and interaction with equipment and tooling.
  • Occasional support outside normal working hours may be required based on production needs.

ST is proud to be one of the 17 companies certified as a 2026 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.

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