PROCESS ENGINEER - OSAT BACKEND

MAIN RESPONSIBILITIES:

·  Develop, set up and optimize Tape & Reel, De-Tape and Tray-to-Tray processes.

·  Define and control machine recipes, process parameters, tooling setup, device orientation and product-specific requirements.

·  Establish and monitor UPH, cycle time, yield and process capability.

·  Define sealing parameters, peel-off strength requirements, acceptance criteria and process reaction plans.

·  Evaluate and qualify carrier tape, cover tape, reels, trays, tooling and related process materials.

·  Define and optimize vacuum sealing and packing process parameters including sealing condition, vacuum level and cycle settings.

·  Establish technical requirements for handling and packing moisture-sensitive products.

·  Create and maintain SOPs, Work Instructions, process specifications, setup sheets and process control documents.

·  Perform process qualification, first-lot setup, new product introduction and production ramp-up.

·  Perform basic machine maintenance, preventive maintenance support and equipment condition checks for backend process equipment.

·  Troubleshoot machine and process-related issues and coordinate repair or technical support when required.

·  Lead technical investigation of process defects, material-related issues and recurring yield loss.

·  Perform root cause analysis and implement corrective and process improvement actions.

·  Analyze process data to identify abnormalities, performance gaps and improvement opportunities.

·  Provide technical requirements for equipment, tooling and process readiness.

·  Provide technical training and guidance to operators and technicians.

·  Support production and capacity planning with validated UPH, cycle time and machine capability data.

REQUIREMENTS:

·  Diploma or Degree in Mechanical, Electrical, Electronics, Mechatronics, Manufacturing Engineering or related field.

·  Preferably 2–5 years of process engineering experience in semiconductor, OSAT or electronics manufacturing.

·  Hands-on experience in Tape & Reel, De-Tape, Tray-to-Tray or semiconductor backend processes is preferred.

·  Experience with vacuum sealing or semiconductor packing processes is an advantage.

·  Strong knowledge of carrier tape, cover tape, sealing process, peel-off strength, device orientation and ESD control.

·  Familiar with moisture-sensitive device handling and semiconductor packing requirements.

·  Able to perform process setup, parameter optimization, troubleshooting and process qualification.

·  Able to perform basic equipment troubleshooting, preventive maintenance and machine condition checks.

·  Able to analyze UPH, cycle time, yield, downtime, process capability and reject trends.

·  Familiar with root cause analysis, SPC, DOE, 8D or similar problem-solving methods is an advantage.

·  Able to prepare SOPs, Work Instructions, process specifications and technical reports.

·  Good analytical, technical problem-solving and communication skills.