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Process Engineer (Plating)

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Onsite

Process Engineer (Plating)

STMicroelectronics Sdn Bhd

Process Engineer (Plating)

Skills

Process ImprovementCompliance

2 months ago

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Important information


Contract type:

Permanent

Location:

Johor Bahru, Johor, Malaysia

Work mode:

Onsite

Published on:

4 September 2026

What they need


YOUR ROLE

Responsible for sustaining, improving, and optimizing plating and resist stripping processes to ensure stable manufacturing performance, high product yield, and continuous process improvement.

  • Provide daily engineering support for plating and resist stripping processes in a high-volume manufacturing environment.
  • Monitor and optimize key process parameters to ensure product quality, process stability, and yield performance.
  • Troubleshoot process excursions, defects, and equipment-related issues and implement effective corrective and preventive actions.
  • Lead root cause analysis and continuous improvement activities using structured problem-solving tools such as 8D, 5 Why, Fishbone Diagram, DOE, and SPC.
  • Drive yield improvement, defect reduction, process capability, cycle time, and manufacturing efficiency projects.
  • Establish and maintain process specifications, SOPs, Control Plans, PFMEA, and reaction plans.
  • Support process qualification, process changes, new product introduction, and equipment/process improvement activities.
  • Work closely with Production, Maintenance, Quality, Facilities, and external suppliers to resolve technical issues and improve process performance.
  • Ensure compliance with company quality systems, safety requirements, and manufacturing standards.

YOUR SKILLS & EXPERIENCES

  • Bachelor’s degree in Chemical Engineering, Materials Engineering, Mechanical Engineering, Semiconductor Engineering, or a related discipline.
  • Minimum 2–5 years of relevant manufacturing or semiconductor process engineering experience.
  • Hands-on experience in electroplating processes is strongly preferred.
  • Experience in resist stripping, wet chemical processes, surface treatment, or semiconductor plating processes is an advantage.
  • Knowledge of process control, SPC, DOE, FMEA, Control Plan, and structured problem-solving methodologies.
  • Strong analytical, troubleshooting, and problem-solving skills.
  • Experience in electroplating process optimization and troubleshooting.
  • Knowledge of plating thickness and uniformity control.
  • Experience in chemical bath monitoring and process control.
  • Familiarity with resist stripping and wet chemical processes.
  • Demonstrated ability to drive yield improvement and defect reduction.
  • Able to work independently and effectively in a fast-paced manufacturing environment.
  • Good communication and teamwork skills.

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