Process Engineer (Plating)

• Responsible in product qualification, performs process definition, set-up and optimization, process documentation review, audit closure and specs update
• Perform technical activities aligned with wafer plating process
• Performs engineering evaluations and documentations needed for the release of process to mass production
• Identify and debug problems in processes, products, equipment and work for solution.
• Propose and implement process improvement/yield improvement in terms of quality, machine capability and performance to increase productivity
• Ensure that the production lines meet and sustain productivity and yield requirements by eliminating causes of variation of 4M's
• Track and monitor activities and ensures they are within schedules
• Responsible for ensuring the implementation of process requirements/standards through collaboration with other functions(unit)
• Support team and company initiated activities in keeping a safe area for working - 5S, Health&Safety, etc
• Drives the team on Continuous Improvement Program and influences team participation on company wide activities
• Data collection and process verification engineering activities (MSA/GR&R/Qualification,etc)
• Generates ECN and other related documents for any process related changes
• Generates PMEA, PCP, and WI's of a specific process step/machine
• Revise/update PFMEA, PCP, WI's based from actions in ECN, MRB and 8D
• Establishes and standardizes process control
• Generates qualification requirements and reports

Experience/Skills:

• At least 3 Years experience in plating process (E-less plating is an advantage) and other related tasks;
• At least one year experience in operating metrology equipment
• Experience in operating of XRF machine, auto titrator and AAS machine is a plus
• Basic chemical handling and chemical analysis (titration)

Education:

• Graduate of Engineering (BSECE, BSME, BSECE, BSCOE or BSIE)