mnosys sdn bhd
Process Engineer – Plating / Wet Process
Skills
4 days ago
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Important information
Contract type:
Permanent
Salary:
MYR 8,000 – MYR 12,000 / month
Location:
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
Work mode:
Onsite
Published on:
17 October 2026
What they need
Key Responsibilities:
- Plating & Wet Process Optimization: Develop, monitor, and optimize electroplating (Cu, Ni, SnAg) and wet processes (etching, cleaning, stripping) using DOE, SPC, and control plans.
- Troubleshooting & Yield: Lead root-cause analysis for plating defects (voids, nodules, poor adhesion) and wet process issues (over/under-etch, contamination).
- Lab Support & Analysis: Perform chemical titrations, CVS, and TOC bath analysis, cross-sectioning, and lab-scale testing for failure analysis.
- Equipment & EHS Compliance: Support tool PMs, chemical tank maintenance, safety risk assessments, and strict EHS protocols.
Requirements:
- Degree in Chemical Engineering, Materials Engineering, Chemistry, or equivalent.
- Hands-on experience in electroplating, wet processes, or semiconductor packaging.
- Knowledge of plating chemistry, SPC, DOE, FMEA, and failure analysis tools.
- Willing to relocate to Singapore (Salary up to SGD6k).
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