Process Engineer (Ti-Etch, Solder ball attach, package saw)

YOUR ROLE

• Own and improve manufacturing process performance for Plasma Etching, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
• Drive day-to-day process control, troubleshooting, and continuous improvement for the assigned processes to reduce production downtime, scrap, and line disruption.
• Act as the key process owner for resolving process-related issues, including yield loss, quality escapes, customer incidents, and internal/external complaints.
• Lead process characterization, optimization, and qualification activities for Plasma Etching, Solder Ball Attach, and Package Saw.
• PerformFMEA, risk assessment, and change management for process or material changes to ensure smooth implementation and robust control.
• Develop, maintain, and improve process recipes, parameters, SOPs, and control plans in alignment with production and quality requirements.
• Collaborate closely with Production, Equipment, Quality, Maintenance, and Customer Quality teams to support operational excellence and business targets.
• Use statistical tools and process control methods such as SPC, Cp/Cpk, GR&R, and other quality tools to monitor stability and drive improvement.
• Support and lead root cause analysis, excursion management, defect reduction, and corrective/preventive actions.
• Initiate and support yield improvement, cost reduction, capacity improvement, and other manufacturing excellence projects.

YOUR SKILLS & EXPERIENCES

• PHD/Master/Bachelor’s degree or higher in Engineering or related field such as Mechanical, Electrical, Material Science, Mechatronics, or Manufacturing Engineering.
• Minimum2 years of process engineering experience in semiconductor assembly/manufacturing, with strong hands-on experience in at least one or more of the following:
  • Plasma Etching
  • Solder Ball Attach
  • Package Saw
• Strong knowledge of process control, troubleshooting, yield improvement, and defect reduction in semiconductor manufacturing.
• Proven experience in root cause analysis, problem solving, FMEA, SPC, and change management.
• Ability to analyze process data, identify trends, and implement effective corrective actions.
• Good understanding of production environment, equipment interaction, and quality requirements.
• Strong communication and collaboration skills, with the ability to work effectively across cross-functional teams.
• Proactive, detail-oriented, and able to respond quickly to process issues in a fast-paced manufacturing environment.
• Experience in excursion prevention, process stabilization, and continuous improvement is highly preferred.