Process Engineer (Wire Bond) - Semiconductor

Summary:

• Good career opportunity
• Basic up to $5000 + transport allowance
• Industry: Semiconductor & Electronics Manufacturing

Job Scope:

• Develop and enhance gold, silver, and copper wire bonding processes to improve capability, stability, and product quality.
• Ensure wire bonding processes comply with customer specifications, quality standards, and technical requirements.
• Conduct failure analysis and identify root causes of wire bonding issues, implementing effective corrective and preventive solutions.
• Coordinate NPI and NPQ activities, including the qualification of new products, materials, devices, and machinery within the required timelines.
• Support new tape and material development, supplier sourcing and qualification, and benchmarking of new materials and equipment technologies.
• Train colleagues on new process implementation and equipment operation, while maintaining, troubleshooting, and performing minor repairs on assembly and test machinery.
• Develop and update Standard Operating Procedures (SOPs), and participate in internal, customer, and external audits.
• Ensure compliance with the Company’s quality, environmental, health, safety, and security policies and procedures.

Job Requirements:

• Diploma or Degree in Engineering, preferably in Electronics, Materials Science, or a related discipline.
• Minimum 3 years of relevant manufacturing experience, preferably in semiconductor assembly and test environments, with hands-on experience operating wire bonders such as ESEC, ASM, or KNS using gold, silver, and copper wires.
• Experience in IC assembly processes, including die attach, wire bonding, encapsulation, testing, and maintenance/troubleshooting of related equipment.
• Strong knowledge of bonding wire and semiconductor materials, with familiarity in process improvement and quality tools such as FMEA, SPC, OCAP, DOE, and relevant ISO standards; good problem-solving, communication, teamwork, and ability to work independently.

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We regret that only shortlisted candidates will be notified.

Staffking Pte Ltd (20C0358) | Chew Poh Seng (R25127164)

EA License No: 20C0358