Process Engineering Professional

RESPONSIBILITIES:

• Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.

• Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations.

• Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).

• Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.

• Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.

• Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization.

• Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability.

• Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process.

• Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.

• Drive automation and digital transformation in molding processes-such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency.

• Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations.

• Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.

• Coordinate with global teams to benchmark molding process technologies and deploy global best practices.

Education:

• Bachelor's degree in Mechanical, Materials, Electronics Engineering or a related field.

Experience Skill:

• Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging.

• Hands-on experience with transfer molding machines, mold tools, and associated metrology systems.

• Strong analytical and statistical skills (SPC, Minitab, JMP, etc.).

• Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test.

• Proven experience in process optimization, problem-solving, and cross-functional collaboration.

RESPONSIBILITIES:

• Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations.

• Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations.

• Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC).

• Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications.

• Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues.

• Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization.

• Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability.

• Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process.

• Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance.

• Drive automation and digital transformation in molding processes-such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency.

• Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations.

• Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation.

• Coordinate with global teams to benchmark molding process technologies and deploy global best practices.

Education:

• Bachelor's degree in Mechanical, Materials, Electronics Engineering or a related field.

Experience Skill:

• Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging.

• Hands-on experience with transfer molding machines, mold tools, and associated metrology systems.

• Strong analytical and statistical skills (SPC, Minitab, JMP, etc.).

• Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test.

• Proven experience in process optimization, problem-solving, and cross-functional collaboration.