Process Integration Development Engineer - Advanced Packaging

Location

:Remote – United States  

Compensation

: $190,000–$250,000 base salary + Equity & Bonus

We are hiring Director, Process Integration & Development

, an innovative technology company working at the forefront of advanced semiconductor packaging and heterogeneous integration

.

This is an exciting opportunity for a senior semiconductor professional to join a founding technical team, lead critical process development initiatives, and contribute to next-generation technologies supporting AI and high-performance computing.

About the Role:

The successful candidate will lead advanced packaging process integration and development while remaining hands-on with laboratory work, process optimization, and technical problem-solving.

Key Responsibilities:

• Lead semiconductor packaging process integration and development.
• Drive process development across **patterning, bonding, and CMP**.
• Solve complex integration challenges independently, from investigation through validation.
• Build and lead technical teams while maintaining hands-on process ownership.
• Support technology validation, manufacturing readiness, and yield improvement.
• Collaborate with technical partners, equipment suppliers, and research teams.

What We're Looking For:

• Typically 8+ years of relevant semiconductor experience.
• Strong hands-on expertise in advanced packaging, process integration, and development.
• Direct experience with patterning, bonding technologies, and CMP.
• Proven technical leadership with a hands-on approach.
• Experience in hybrid bonding, chiplets, 2.5D/3D integration, or related technologies is an advantage.
• Existing U.S. work authorization is required.
• Ability to undertake 50%+ international travel, including potential extended stays abroad.

Education:

A master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, or a related field is listed in the original job description.

Why Consider This Opportunity?

• Join a founding technical team.
• Help develop innovative semiconductor packaging technologies.
• Combine strategic leadership with hands-on engineering.
• Receive a competitive base salary alongside equity and bonus opportunities.

Interested or know someone who could be a great fit? Apply directly or send a message to learn more.