Process Integration Engineer

Mojo Vision is pioneering a highly flexible, wafers-in, wafers-out micro-LED platform to unlock AI applications in multiple market segments. Built over the past decade by our world-class engineers, our system-level approach combines advanced 300mm silicon architecture with GaN-on-Silicon emitters, proprietary quantum dots, photodetectors, micro-lens arrays, and packaging to solve conventional trade-offs in size, brightness, bandwidth density, and power. Our scalable, manufacturing-ready approach enables breakthrough products such as next-generation optical interconnects and AI glasses.

At Mojo, our team includes talented professionals with expertise in hardware, software, optics, photonics, electronics, chemistry, and applied physics. We are based in Cupertino, California and are backed by some of the world’s leading technology investors.

Roles and Responsibilities:

We are seeking an exceptional Process Integration Engineer to play a critical role in advancing Mojo Vision’s micro-LED technology platform. This position offers the opportunity to influence device architecture, manufacturing strategy, and process development across a broad range of semiconductor and optoelectronic technologies.

As a highly visible technical leader, you will collaborate closely with internal device, process, and product teams while managing partnerships with world-class foundries, equipment suppliers, and development partners. You will drive process integration efforts that directly impact device performance, yield, reliability, and manufacturability.

• Lead process integration activities across Mojo’s micro-LED device development programs.
• Develop, optimize, and scale semiconductor and optoelectronic process flows through data-driven experimentation and process window optimization.
• Collaborate with fabrication partners to define process requirements, troubleshoot challenges, and drive continuous improvement.
• Partner with device, materials, characterization, and product teams to improve overall device performance and manufacturing readiness.
• Drive root cause analysis and corrective action activities for process excursions and device failures.
• Evaluate new equipment, materials, and manufacturing approaches to enable future technology roadmaps.
• Define and drive process integration strategy and technology development initiatives.
• Communicate complex technical issues clearly and effectively to both internal and external stakeholders.

Required Skills:

• M.S. or Ph.D. in Materials Science, Electrical Engineering, Physics, Chemical Engineering, or a related technical discipline.
• 8+ years of industry experience in semiconductor, optoelectronic, or advanced device development.
• Proven hands-on experience in process development and integration within an industrial cleanroom environment.
• Deep understanding of semiconductor process integration and process interactions across multiple modules.
• Experience with several of the following process technologies: Lithography; Dry and wet etching; Deposition; Metrology; Plating; Chemical Mechanical Planarization (CMP); Damascene processes; Hybrid bonding; BEOL processing (grinding, polishing, CMP, and dicing)
• Demonstrated expertise in data-driven process optimization using: Design of Experiments (DOE); Statistical Process Control (SPC) charts; Failure Mode and Effects Analysis (FMEA); Failure Analysis and Corrective Action (FACA)
• Proven ability to identify fabrication issues, perform root cause analysis, and implement corrective actions.
• Fabrication experience with III-V devices, specifically uLEDs, is preferred.
• Experience with layout tools, specifically DW-2000.
• Excellent communication and interpersonal skills, with a track record of effective cross-functional and cross-cultural collaboration.
• Proven ability to lead and manage multiple technical projects simultaneously.
• Solid understanding of optoelectronic III-V devices, with the ability to provide technical assessments and guidance.
• Willingness to travel domestically up to 15%, based on program needs.

Preferred Skills:

• Ph.D. with 5+ years of relevant industry experience.
• Direct experience with III-V semiconductor device fabrication and process integration and micro-LED development and manufacturing.
• Experience characterizing GaN/Si optical devices, particularly at high power density.
• Strong understanding of GaN epitaxy, device physics, and manufacturing processes related to GaN/Si epi and optical device fabrication and system integration.
• Proven success transferring technologies into high-volume manufacturing environments.
• Strong attention to detail with the ability to manage and meet aggressive timelines.

Level: Principal Engineer

Salary Range: $194K-$232K-$287K

Or

Level: Distinguished Engineer

Salary Range: $215K-$245K-$339K